WMSIC Electronic Components

Viking AR02DTD4752

ModelAR02DTD4752
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR02DTD4752
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR02DTD4752
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.009g
Electronic Component
47.5kΩ
Electronic Component
1
Electronic Component
BM0265966185
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±50ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR02DTD4752 薄膜贴片电阻产品概述

一、产品核心定位与品牌背景

AR02DTD4752是光颉电子(Viking) 推出的0402封装精密薄膜贴片电阻,针对高密度、低功耗、宽温域的电路设计需求开发。光颉作为全球被动元件领域的专业供应商,其薄膜电阻产品以阻值一致性高、长期稳定性好、环境适应性强为核心优势,广泛覆盖工业、汽车、消费电子等场景。该型号采用真空溅射薄膜工艺,相比传统厚膜电阻,在精度控制、噪声抑制和温度稳定性上具备显著差异,是小体积精密电路的理想选型。

二、关键电气性能参数解析

2.1 阻值与精度

标称阻值为47.5kΩ(代码标识“4752”,前三位为有效数字,第四位表示乘以10²),精度等级**±0.5%**——满足工业控制、传感器信号调理等对阻值误差要求较严格的场景,无需额外校准即可实现稳定电路性能。

2.2 功率与电压限制

额定功率62.5mW(0402封装典型规格),适配低功耗电路;工作电压额定值25V,需注意:实际电路中电压与电流的乘积不得超过额定功率(如25V下最大电流约0.526mA),避免过功率导致阻值漂移或失效。

2.3 温度系数(TCR)

温度系数**±50ppm/℃**,即温度每变化1℃,阻值变化±47.5kΩ×50×10⁻⁶=±2.375Ω。该参数确保电阻在-55℃至+155℃范围内阻值稳定,适合户外设备、工业高温模块等极端环境。

三、物理封装与工艺特性

3.1 封装规格

采用0402封装(英制尺寸,对应公制1005),实际尺寸约1.0mm×0.5mm×0.35mm,体积紧凑,可有效降低PCB布局空间,适配智能手机、智能穿戴、小型工业模块等高密度设计。

3.2 薄膜工艺优势

该电阻采用真空溅射镍铬薄膜工艺,相比厚膜电阻的丝网印刷工艺,具备三大核心优势:

  • 阻值一致性更高:批量生产阻值偏差控制在±0.1%以内(远优于厚膜的±1%);
  • 噪声更低:电流噪声约0.1μV/V·Hz(1kHz),适合音频、传感器等噪声敏感电路;
  • 长期稳定性好:155℃下施加额定功率1000小时后,阻值变化率≤0.1%。

四、环境适应性与可靠性

4.1 温湿度适应性

工作温度范围**-55℃至+155℃**,覆盖工业级宽温需求,可满足汽车电子(如车身控制器)、户外监测设备等极端场景;湿度适应性为95%RH以下(无凝露),存储温度-65℃至+150℃,可长期稳定保存。

4.2 可靠性验证

光颉对该型号完成多项行业标准测试:

  • 温度循环测试:-55℃至+155℃循环500次,阻值变化≤0.2%;
  • 耐焊接热测试:回流焊峰值260℃±5℃持续10秒,无外观损坏及阻值漂移;
  • ESD测试:接触放电±8kV、空气放电±15kV,无失效。

五、典型应用场景

AR02DTD4752因体积小、精度高、宽温稳定,广泛应用于:

  1. 便携式电子:智能手机传感器信号调理、智能手表低功耗电源模块;
  2. 工业控制:PLC模拟量输入模块、温度传感器放大电路;
  3. 汽车电子:车身控制器灯光调节、胎压监测信号滤波;
  4. 消费电子:蓝牙耳机音频滤波、智能家居传感器接口电路。

六、选型与使用注意事项

6.1 功率降额设计

建议实际功率不超过额定功率的50%(即31.25mW),提升长期可靠性;

6.2 焊接工艺要求

  • 回流焊:峰值260℃±5℃,升温≤3℃/s,降温≤2℃/s,总时间≤60秒;
  • 手工焊接:烙铁温度≤350℃,焊接时间≤3秒,避免多次焊接;

6.3 存储与防护

  • 未开封产品存储于1535℃、4060%RH环境,开封后12个月内使用;
  • 电路需增加ESD防护(如串联100Ω电阻),避免静电损伤。

该型号平衡了小体积与高性能,是精密电路设计中替代普通厚膜电阻的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.