WMSIC Electronic Components

Viking AR02BTD2003

ModelAR02BTD2003
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
Viking AR02BTD2003
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR02BTD2003
Electronic Component
1
Package
0402
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0265817368
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR02BTD2003 薄膜电阻产品概述

一、产品定位与品牌背景

AR02BTD2003是台湾光颉电子(Viking)推出的高精度薄膜电阻,隶属于其工业级/汽车级电阻系列,核心定位为小型化精密电路的稳定信号载体。光颉电子作为全球被动元件领域的资深制造商,深耕电阻技术数十年,其薄膜电阻以「低漂移、高可靠、抗恶劣环境」为核心优势,广泛覆盖工业控制、医疗设备、汽车电子等高端场景。AR02BTD2003针对「精度敏感+体积受限」的设计痛点,兼顾性能与集成度,是替代常规精度电阻的优选方案。

二、核心参数解析

该电阻的参数覆盖「精度、温度稳定性、功率适配」等关键维度,具体如下:

  • 阻值与精度:固定阻值200kΩ,精度达±0.1%(远高于常规电阻1%~5%的精度),可将电路信号偏差控制在极小范围;
  • 功率与电压:额定功率62.5mW,最大工作电压25V,功率-电压关系匹配0402封装的承载极限,适配低功耗电路;
  • 温度系数(TCR):±50ppm/℃,即温度每变化1℃,阻值变化约0.005%,宽温下阻值漂移极小;
  • 工作温度:-55℃~+155℃,覆盖工业级及部分汽车级应用的极端温度需求;
  • 封装:0402(英制)/1005(公制)封装,体积仅0.4mm×0.2mm左右,支持高密度PCB布局。

三、关键性能特点

  1. 高精度+低漂移:±0.1%精度与±50ppm/℃ TCR结合,确保阻值在「温度波动+长期使用」中保持稳定,避免信号失真;
  2. 薄膜工艺优势:采用镍铬合金薄膜技术,相比碳膜/金属膜电阻,具有更低噪声、更高抗硫化性、更长寿命,适合高可靠场景;
  3. 小体积高密度:0402封装可将贴装密度提升至每平方厘米数百个,适配智能手表、车载模块等小型化设备;
  4. 宽温适应性:-55℃~+155℃的温度范围,可稳定工作于户外传感器、汽车发动机舱等极端环境。

四、典型应用场景

AR02BTD2003的性能特性使其适配多类高端领域:

  • 工业控制:温度/压力传感器的信号调理电路,精准采集微弱模拟信号;
  • 医疗设备:心电图机、血糖检测仪的信号放大模块,低漂移保障测量准确性;
  • 汽车电子:胎压监测、氧传感器的信号处理电路,宽温适应汽车内外温度波动;
  • 通信设备:小型化基站、路由器的射频前端,小体积支持高密度集成;
  • 消费电子:高端智能穿戴(手表/耳机)的电源管理模块,兼顾精度与尺寸。

五、可靠性与环境适应性

该电阻基于光颉成熟工艺,可靠性满足工业级要求:

  • 负载寿命:额定功率下连续工作1000小时,阻值变化率<0.1%;
  • 机械耐受性:符合IPC-A-610标准,抗振动/冲击性能优异,适配工业现场机械应力;
  • 抗硫化性能:薄膜材料与封装优化,降低含硫环境(如部分工业场所)对电阻的腐蚀影响。

六、封装与尺寸说明

AR02BTD2003采用0402封装(公制1005),具体尺寸:

  • 长度:0.40±0.02mm;
  • 宽度:0.20±0.02mm;
  • 厚度:0.13±0.03mm;
  • 焊盘间距:0.30±0.02mm。
    小体积设计可大幅减少PCB占用面积,提升产品集成度与便携性。

总结

AR02BTD2003是光颉针对精密电子领域的「性能-尺寸平衡型」薄膜电阻,以±0.1%精度、±50ppm/℃ TCR及0402封装为核心优势,覆盖工业、医疗、汽车等多场景需求,是高端电子设备中「信号精准传输+小型化集成」的可靠选择。

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