WMSIC Electronic Components

Viking ARG02BTC6200

ModelARG02BTC6200
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
Viking ARG02BTC6200
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02BTC6200
Electronic Component
1
Package
0402
Electronic Component
0.009g
Electronic Component
1
Electronic Component
BM0265817353
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉ARG02BTC6200薄膜贴片电阻产品概述

Viking(光颉)ARG02BTC6200是一款针对精密电子电路设计的0402封装薄膜贴片电阻,凭借高精度、宽温稳定性与小体积优势,广泛适配各类小型化、高可靠性电子设备的信号处理与功率调节场景。

一、产品核心身份与基础参数

ARG02BTC6200隶属于光颉ARG系列精密薄膜电阻产品线,明确核心属性为薄膜型贴片电阻,封装规格为0402(英制尺寸)。其基础参数清晰明确:

  • 标称阻值:620Ω
  • 阻值精度:±0.1%(高精度等级)
  • 额定功率:62.5mW(0402封装常规功率上限)
  • 最大工作电压:50V
  • 温度系数(TCR):±25ppm/℃
  • 工作温度范围:-55℃至+155℃

以上参数覆盖了电路设计中阻值、功率、电压、环境适应性的核心需求,为下游应用提供明确的选型依据。

二、关键性能指标解析

ARG02BTC6200的性能优势集中体现在高精度与温稳定性两大维度:

  1. 高精度阻值控制:±0.1%的精度远高于普通碳膜电阻(通常±1%~±5%),通过激光微调薄膜层实现阻值精准度,可满足精密仪器校准、射频匹配网络等对阻值误差敏感的场景;
  2. 宽温下阻值稳定:±25ppm/℃的温度系数意味着,当环境温度变化100℃时,阻值漂移仅0.25%,远优于金属膜电阻(通常±50ppm/℃以上),适合极端温环境(如汽车电子、工业控制);
  3. 功率与电压适配性:62.5mW额定功率匹配0402封装的小体积设计,50V最大工作电压在同类封装中处于较高水平,可覆盖低功率信号电路与中等电压调节场景。

三、封装与尺寸特征

ARG02BTC6200采用0402封装(公制尺寸约1.0mm×0.5mm×0.4mm),这一规格的优势在于:

  • 体积小巧:仅为0603封装的1/4左右,可大幅提升PCB板的集成密度,适配智能手表、蓝牙耳机等便携设备的小型化需求;
  • 焊接兼容性:符合标准贴片封装规范,支持回流焊、波峰焊等自动化生产工艺,适配大规模量产;
  • 机械可靠性:封装材料采用耐高温环氧树脂,可承受焊接过程中的高温冲击,长期使用不易出现脱焊、开裂问题。

四、典型应用场景

结合ARG02BTC6200的参数特性,其核心应用场景集中在以下领域:

  1. 精密测量仪器:示波器、信号发生器的信号校准电路,需高精度阻值保证信号幅度与相位的准确性;
  2. 医疗电子设备:小型监护仪、血糖仪的传感器信号调理电路,需稳定的温漂特性避免环境温度对检测结果的干扰;
  3. 通信射频前端:基站、路由器的射频匹配网络,0402封装适配高密度射频模块设计,高精度阻值优化信号传输效率;
  4. 高端消费电子:降噪耳机的音频滤波电路、智能手表的电源管理模块,小体积与高可靠性满足便携设备的使用需求;
  5. 工业控制模块:PLC、传感器节点的信号转换电路,宽温范围(-55℃~+155℃)适配工业现场的极端环境。

五、可靠性与环保特性

  1. 长期稳定性:薄膜电阻采用真空溅射工艺形成电阻层,相比碳膜、金属膜电阻,阻值漂移更小(长期使用漂移≤0.1%/1000小时),适合对寿命要求高的设备;
  2. 环境适应性:工作温度范围覆盖工业级与汽车级需求,耐湿等级符合IEC 60068-2-67标准(湿度95%RH下稳定工作);
  3. 环保合规:产品符合RoHS 2.0、REACH等环保法规要求,无铅封装适配绿色制造趋势。

六、品牌与品质保障

Viking(光颉)作为台湾精密电阻领域的主流厂商,ARG系列产品具备以下品质优势:

  • 生产工艺:采用全自动激光微调设备,阻值精度一致性控制在±0.05%以内(高于标称精度);
  • 认证资质:通过ISO 9001质量管理体系、ISO 14001环境管理体系认证,部分产品获得AEC-Q200汽车级认证;
  • 供货稳定性:拥有完善的供应链体系,可满足批量订单的持续交付需求。

ARG02BTC6200凭借高精度、小体积、宽温稳定的特性,成为精密电子电路设计中0402封装薄膜电阻的优选方案,适配多领域的小型化、高可靠性需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.