WMSIC Electronic Components

Viking ARG03DTC2701

ModelARG03DTC2701
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
Viking ARG03DTC2701
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03DTC2701
Electronic Component
1
Package
0603
Electronic Component
0.023g
Electronic Component
1
Electronic Component
BM0265966186
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking ARG03DTC2701 薄膜固定电阻器产品概述

一、产品基本概况

Viking(光颉)ARG03DTC2701是一款精密薄膜表面贴装固定电阻,采用0603(英制)小型封装,专为对阻值精度、温度稳定性要求较高的电子电路设计。作为光颉电阻产品线中的中高精密型号,其核心参数覆盖工业级、汽车级场景的可靠性需求,兼顾小型化与性能稳定性。

二、核心性能参数详解

ARG03DTC2701的关键参数明确且适配多场景,具体如下:

  1. 阻值与精度:标称阻值2.7kΩ(型号代码“2701”对应“270×10¹=2700Ω”),精度等级±0.5%,属于精密级电阻(相比普通碳膜电阻±5%精度提升10倍),可满足模拟电路测量、控制的精度要求;
  2. 功率与电压:额定功率100mW(0.1W),最大连续工作电压75V,在0603封装尺寸下实现功率与电压的平衡,适合小电流、中低压电路;
  3. 温度特性:温度系数(TCR)为±25ppm/℃,表示环境温度每变化1℃,阻值变化不超过百万分之25,远优于普通电阻(如碳膜电阻TCR通常>100ppm/℃),宽温范围内阻值稳定性优异;
  4. 工作温度范围:-55℃至+155℃,覆盖工业级与汽车级环境温度要求,可在极端高低温场景下长期稳定工作。

三、封装与工艺特点

ARG03DTC2701采用0603表面贴装封装(公制尺寸1.6mm×0.8mm×0.5mm),体积小、重量轻,适合高密度PCB布局(如智能手机、小型化工业模块)。其薄膜电阻工艺采用陶瓷基底+镍铬薄膜沉积+光刻调阻技术:

  • 陶瓷基底:热稳定性好,可承受回流焊等高温焊接工艺;
  • 镍铬薄膜:低噪声、低漂移,长期使用阻值变化<0.1%/1000小时;
  • 环氧树脂封装:防护性能佳,抗潮湿、抗机械应力,提升环境适应性。

四、典型应用领域

基于ARG03DTC2701的精密性、宽温特性与小封装优势,典型应用场景包括:

  1. 消费电子:智能手机、平板电脑的电源管理IC(PMIC)分压电路、信号调理模块;
  2. 工业控制:PLC模拟量输入输出(AI/AO)接口、传感器信号放大电路;
  3. 汽车电子:车载导航信号处理单元、ADAS传感器(如毫米波雷达)前置滤波电路(宽温适配汽车舱内外环境);
  4. 通信设备:路由器、交换机的射频前端分压、数字电路限流;
  5. 医疗电子:便携式血糖仪、血压计的精密检测电路(±0.5%精度满足医疗设备测量要求)。

五、可靠性与使用注意事项

  1. 可靠性:薄膜工艺确保长期稳定性,环氧树脂封装提升抗环境应力能力,适合 harsh 场景;
  2. 使用限制:实际工作功率建议不超过额定功率的80%(即80mW),避免过载;连续工作电压不超过75V,防止击穿;
  3. 焊接要求:适配回流焊、波峰焊工艺,焊接峰值温度需<260℃(符合0603封装电阻标准)。

六、选型替换参考

若需替换ARG03DTC2701,需确保以下参数完全匹配:

  • 阻值:2.7kΩ;
  • 精度:±0.5%;
  • 温度系数:±25ppm/℃;
  • 封装:0603;
  • 额定功率:100mW;
  • 最大工作电压:75V。

该型号凭借精密性能与宽温特性,成为消费电子、工业控制等领域的高性价比选型。

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