Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Viking ARG05FTC3301
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking ARG05FTC3301
- Type
- VIKING
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- ARG05FTC3301
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.029g
- Electronic Component
- 3.3kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264911515
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Viking ARG05FTC3301 薄膜贴片电阻产品概述
一、产品基本信息
ARG05FTC3301是光颉（Viking）推出的0805封装薄膜贴片电阻，专为中高端电子设备的稳定信号传输与功率控制设计。该型号采用薄膜电阻工艺，兼具高精度、宽温适应性与小体积特点，是工业控制、消费电子等领域的常用基础元器件。
二、核心技术参数
ARG05FTC3301的关键技术参数明确了其性能边界，核心指标如下：
- 阻值与精度：3.3kΩ（3300Ω），精度±1%，可满足多数电路对阻值一致性的要求；
- 功率规格：额定功率125mW，可稳定承载常规信号电路的功率需求；
- 工作电压：最大工作电压150V，电压裕量充足，避免过压损坏；
- 温度系数：±25ppm/℃，阻值随温度变化极小（如100℃温差下，阻值变化仅约8.25Ω）；
- 工作温度范围：-55℃~+155℃，覆盖工业级极端环境需求。
三、性能特点
ARG05FTC3301依托薄膜电阻工艺与优化设计，具备以下核心优势：
- 高精度低漂移：±1%精度结合±25ppm/℃温度系数，阻值稳定性远超普通碳膜/厚膜电阻，长期使用阻值漂移小；
- 宽温环境适配：-55℃低温无性能衰减，+155℃高温下仍能稳定工作，满足工业现场、户外设备等极端温度场景；
- 小封装高密度：0805封装（英制尺寸2.0mm×1.2mm），适合PCB板高密度布局，助力设备小型化；
- 低噪声高可靠性：薄膜工艺相比碳膜电阻噪声更低，适合音频、传感器等对信号纯净度要求高的电路；
- 电压与功率裕量：150V工作电压与125mW额定功率匹配性好，避免电路设计中“过压过载”风险。
四、典型应用场景
ARG05FTC3301的性能适配多领域需求，典型应用包括：
- 工业控制设备：PLC（可编程逻辑控制器）的信号调理电路、传感器接口、电机驱动辅助电阻；
- 消费电子：高端音频设备（如耳机放大器、音箱分频电路）、智能家居控制模块；
- 汽车电子：辅助控制系统（如车身传感器、车载显示接口）的宽温场景应用；
- 通信设备：基站射频辅助电路、路由器/交换机的接口电阻（高密度PCB需求）；
- 医疗仪器：小型诊断设备（如血糖仪、心电图仪）的低噪声信号电路。
五、可靠性与环境适应性
ARG05FTC3301通过严格的可靠性测试，满足工业级标准：
- 长期稳定性：薄膜电阻的阻值漂移率低于厚膜电阻，符合IEC 61000等可靠性标准；
- 耐环境性能：可承受85%RH湿度环境（常规贴片电阻标准），抗振动、冲击性能优于插件电阻；
- 焊接兼容性：支持回流焊、波峰焊等常规贴片焊接工艺，焊接后性能无衰减。
该产品以高性价比、稳定可靠的特点，成为电子设计中替代普通贴片电阻的优选方案，尤其适合对精度、宽温有要求的中高端应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
