WMSIC Electronic Components

Viking ARG03BTC3002

ModelARG03BTC3002
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03BTC3002
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03BTC3002
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.023g
Electronic Component
30kΩ
Electronic Component
1
Electronic Component
BM0263676805
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

光颉(Viking)ARG03BTC3002薄膜电阻产品概述

ARG03BTC3002是光颉(Viking)针对高精度、宽温稳定应用场景设计的工业级薄膜电阻,以0603小封装实现100mW功率输出,具备±0.1%高精度与±25ppm/℃低温度系数,适配多类电子系统的核心电阻需求。

一、产品核心信息总览

该型号的参数与型号编码对应清晰,关键信息如下:

类别 具体参数 型号编码说明 电阻类型 薄膜电阻(金属膜/合金膜工艺) ARG为光颉薄膜系列 封装 0603(英制:1.6mm×0.8mm) 03对应0603封装 阻值 30kΩ 3002=30×10²Ω 精度 ±0.1%(E96系列高精度等级) —— 额定功率 100mW(25℃环境下) —— 最大工作电压 75V(直流/交流峰值) —— 温度系数(TCR) ±25ppm/℃(25℃基准) —— 工作温度范围 -55℃~+155℃(工业级宽温) —— 品牌 光颉(Viking) ——

二、关键性能指标深度解析

1. 高精度阻值控制

±0.1%的精度等级远优于普通碳膜电阻(通常±5%~±1%),可满足医疗监护仪信号采集、示波器校准电路等对阻值精准度要求严苛的场景——若电阻精度不足,易导致信号失真或测量误差(如血压监测模块的分压电路,0.1%精度可将误差控制在0.3mmHg以内)。

2. 低漂移温度特性

±25ppm/℃的TCR意味着:在-55℃至+155℃范围内,阻值随温度变化的最大漂移量仅为30kΩ×(155-25)×25e-6=0.0975kΩ(约0.325%),几乎不影响电路性能。例如户外工业传感器(如温度传感器、压力变送器)在极端温差下,仍能保持稳定的信号输出。

3. 功率与电压适配性

  • 100mW额定功率:覆盖微控制器上拉/下拉电阻、低功耗传感器电路等中小功率场景,无需额外降额设计;
  • 75V最大工作电压:适配常见直流电路(如电池管理系统的电压采样),避免过压导致的绝缘击穿。

4. 工业级宽温可靠性

-55℃~+155℃的工作温度符合IEC 60068-2-1/2工业环境标准,可直接应用于航空航天辅助电路、高温工业设备(如冶金炉温度监测),无需额外温度补偿模块,降低系统复杂度。

三、封装特点与典型应用场景

1. 0603封装优势

  • 体积小巧:1.6mm×0.8mm尺寸,适合智能手机射频模块、可穿戴设备传感器电路等高密度PCB布局;
  • 焊接兼容性:支持回流焊、波峰焊等常规工艺,批量生产良率高(≥99.5%)。

2. 典型应用领域

应用场景 核心需求匹配 精密仪器仪表 高精度校准、低漂移信号调理 工业控制与自动化 宽温稳定、抗干扰(薄膜电阻噪声低) 高端消费电子 小封装集成、低功耗 通信设备 射频匹配网络、偏置电路的稳定性

四、品牌与可靠性保障

光颉(Viking)作为全球被动元器件龙头企业,ARG03BTC3002具备以下可靠性优势:

  • 工艺成熟:采用真空溅射薄膜工艺,阻值一致性优于±0.05%(批量生产);
  • 环保认证:通过RoHS、REACH认证,无铅无卤;
  • 可靠性测试:覆盖高温存储(155℃/1000h)、温度循环(-55℃~+155℃/1000次)等项目,MTBF(平均无故障时间)≥10⁶小时。

总结

ARG03BTC3002以高精度、宽温稳定、小封装为核心优势,适配工业控制、精密仪器、高端消费电子等多领域的严苛需求,是替代传统碳膜电阻的高性价比选择。

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