WMSIC Electronic Components

Viking AR02DTC1002

ModelAR02DTC1002
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR02DTC1002
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR02DTC1002
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.009g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0264480882
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉AR02DTC1002薄膜电阻产品概述

Viking(光颉)AR02DTC1002是一款专为高密度、高精度电路设计的0402封装金属薄膜电阻,兼具小体积、高稳定性与宽温适应性,广泛覆盖消费电子、工业控制、汽车电子及通信设备等领域。以下从核心定位、参数解析、工艺优势、可靠性及应用注意事项展开详细说明。

一、产品核心定位与典型应用场景

AR02DTC1002定位于小功率高精度薄膜电阻,针对PCB空间受限、阻值精度要求高、环境温度变化大的电路设计,典型应用包括:

  1. 消费电子:智能手机/平板的电源管理模块(LDO反馈分压)、音频接口信号衰减;
  2. 工业控制:传感器信号调理(压力/温度传感器放大分压)、小型PLC数字接口;
  3. 汽车电子:车载信息娱乐系统CAN总线终端匹配、车身控制模块低功耗辅助电路(适配-55℃~155℃宽温);
  4. 通信设备:射频前端小信号滤波匹配、光纤收发器偏置电压调节(薄膜电阻高频噪声低)。

二、关键参数深度解析

核心参数围绕“高精度、宽温稳定、小功率平衡”设计,具体解析如下:

  1. 阻值与精度:标称10kΩ,精度±0.5%(远高于普通碳膜电阻±5%~±1%),可满足分压电路输出电压误差≤0.5%的需求;
  2. 功率与电压:额定功率62.5mW,最大工作电压25V。需注意:满功率电流为25V/10kΩ=2.5mA,长期工作建议降额50%~80%(实际功率≤31.25mW50mW,电压≤17.7V22.4V),避免过热漂移;
  3. 温度系数(TCR):±25ppm/℃,即温度每变1℃,阻值变化±25×10⁻⁶。以-55℃~155℃为例,最大温度变化210℃,阻值总变化≤±0.525%,结合±0.5%精度,总误差≤±1.025%,宽温稳定性优异;
  4. 工作温度范围:-55℃+155℃,覆盖工业级(-40℃+85℃)与汽车级(-55℃~+155℃)要求,适配极端环境(如汽车发动机舱、户外传感器)。

三、封装与制造工艺优势

  1. 0402封装:英制尺寸(0.04″×0.02″,公制1005),体积仅1.0mm×0.5mm,显著节省PCB空间,适合多层高密度集成(如智能手机主板);
  2. 金属薄膜工艺:采用镍铬合金(NiCr)电阻层,相比碳膜电阻:
    • 噪声更低(典型≤-40dB);
    • 高频特性优(截止频率达几十GHz);
    • 阻值稳定性远超碳膜/金属氧化膜;
  3. 封装结构:陶瓷基板为基础,涂覆环氧树脂保护层,兼具良好散热(陶瓷热导率高于FR4)与机械强度,可承受焊接热应力及振动。

四、可靠性与环境适应性验证

AR02DTC1002通过多项行业标准测试,确保长期稳定:

  1. 负载寿命测试:155℃、额定功率下连续工作1000小时,阻值变化≤±0.1%(符合MIL-STD-202);
  2. 环境测试:通过高温存储(155℃/1000h)、温度循环(-55℃~155℃/1000次)、湿度偏压(85℃/85%RH/25V/1000h),电性能无明显衰减;
  3. 质量认证:符合ISO9001、IATF16949(汽车级)体系,满足工业与汽车领域质量要求。

五、选型与应用注意事项

  1. 功率降额优先:长期工作必须降额50%以上,避免满功率运行;
  2. 焊接工艺:0402封装需注意贴装精度(防桥接),回流焊峰值温度240℃~250℃,时间≤30秒;
  3. 存储条件:未开封产品存于15℃~35℃、湿度≤60%环境,存储期12个月以上,开封后1个月内使用;
  4. 宽温应用:若需精度≤±0.1%,需结合TCR筛选电阻,或采用更低TCR型号。

AR02DTC1002凭借小封装、高精度、宽温稳定的平衡设计,成为高密度电路的理想选择,可满足多领域多样化需求。

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