WMSIC Electronic Components

Viking AR02BTC2003

ModelAR02BTC2003
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR02BTC2003
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR02BTC2003
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
200kΩ
Electronic Component
1
Electronic Component
BM0263676823
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR02BTC2003薄膜贴片电阻产品概述

一、产品基本信息

AR02BTC2003是Viking(光颉)品牌推出的0402封装高精度薄膜贴片电阻,专为小型化、高可靠性电子设计打造。该型号采用真空溅射薄膜工艺制造,兼具低温度系数、宽温稳定性与贴片式适配性,覆盖工业级、汽车级及消费级多场景应用需求。

二、核心性能参数解析

  1. 阻值与精度:标称阻值200kΩ,精度±0.1%——属于工业级高精度电阻范畴,可满足信号校准、精密采样等对阻值误差要求严苛的场景;
  2. 功率与电压:额定功率62.5mW,最大工作电压25V。实际使用需保证功耗≤额定值(公式:(P=U^2/R),25V下实际功耗31.25mW,远低于额定值,安全性可靠);
  3. 温度特性:温度系数±25ppm/℃——远低于普通碳膜电阻(典型±500ppm/℃),阻值随温度变化极小,宽温环境下性能稳定;
  4. 工作温度范围:-55℃~+155℃——覆盖工业级、汽车级应用的极端温度需求,可在高低温循环环境中保持性能一致性。

三、设计与工艺优势

  1. 薄膜工艺核心:采用真空溅射薄膜技术,膜层均匀性优于碳膜/金属膜,实现高精度、低噪声与低温度系数;
  2. 小型化封装:0402封装(尺寸1.0mm×0.5mm),适配高密度PCB设计,可缩小产品体积(如智能穿戴、微型传感器);
  3. 贴片适配性:表面贴装设计,支持自动化SMT生产,焊接可靠性符合IPC-A-610标准,减少人工成本;
  4. 抗环境干扰:薄膜膜层稳定性强,抗潮湿、抗机械应力性能优异,长期使用阻值漂移≤0.1%。

四、典型应用场景

  1. 精密仪器仪表:万用表、示波器的校准电路(依赖±0.1%精度实现准确测量);
  2. 汽车电子:车载传感器(胎压、温度)的信号调理电路(宽温-55~155℃适配车载冷热变化);
  3. 通信设备:基站、路由器的射频滤波/分压电路(0402封装支持高密度PCB布局);
  4. 工业控制:PLC、工业传感器接口的采样电路(低温度系数保证不同环境下精度一致);
  5. 高端消费电子:无线耳机、智能手表的音频放大电路(小封装+低噪声提升音质)。

五、品牌与可靠性保障

Viking(光颉)专注薄膜电阻研发20余年,AR02BTC2003通过以下可靠性验证:

  • 环保认证:RoHS 2.0、REACH(无铅无有害物质);
  • 可靠性测试:高温存储(155℃/1000h)、温度循环(-55~155℃/1000次),阻值漂移≤0.1%;
  • 批量一致性:生产过程采用自动化检测,阻值分布均匀,适合大规模工业化应用。

六、选型与使用注意事项

  1. 功率匹配:实际功耗需≤62.5mW,避免过载导致阻值漂移;
  2. 温度范围:确认应用环境温度在-55~155℃内,超出范围需降额使用;
  3. 精度适配:若场景精度要求≤±0.5%,可选择同封装更低精度型号降低成本;
  4. 焊接工艺:0402封装需采用回流焊温度曲线(峰值240~250℃),避免虚焊或过热损坏。

该型号凭借高精度、宽温稳定与小型化优势,成为工业控制、汽车电子等领域的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.