WMSIC Electronic Components

Viking AR05BTDW1002

ModelAR05BTDW1002
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR05BTDW1002
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR05BTDW1002
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.029g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0264480921
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±50ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR05BTDW1002 — Viking(光颉) 0805 薄膜贴片电阻 10kΩ ±0.1% 125mW

一、产品简介

AR05BTDW1002 为 Viking(光颉) 系列高精度薄膜贴片电阻,阻值 10kΩ,公差 ±0.1%,额定功率 125mW,工作电压 150V,温度系数(TCR)±50ppm/℃,工作温度范围 -55℃ ~ +155℃,封装尺寸 0805。该器件以薄膜工艺实现优异的长期稳定性和低噪声特性,适合对精度与稳定性要求较高的电子系统。

二、主要性能特点

  • 高精度:阻值公差 ±0.1%,适用于精密分压与测量电路。
  • 低温漂:TCR ±50ppm/℃,保证温度变化下阻值波动小。
  • 宽温度范围:-55℃ 到 +155℃,适应工业级环境。
  • 良好稳定性与低噪声:薄膜工艺降低电阻噪声并提高长期漂移特性。
  • 小型封装:0805 便于轻薄化与高密度布板。

三、典型应用场景

适用于精密模拟前端、ADC/DAC 采样电路、传感器信号调理、精密分压器、滤波与补偿网络、工业与仪表设备以及通信和医疗电子中对阻值精度与温度稳定性要求较高的场合。

四、设计与使用建议

  • 降额使用:随环境温度升高需按厂方降额曲线降低允许功率,避免长期满载工作。
  • 布局与散热:保持焊盘对称以减少机械应力,远离高温器件与热源以利散热与稳定。
  • 测试与测量:为保证精度,建议在板上进行四端测量或补偿测量误差。
  • 焊接工艺:支持回流焊,遵循推荐回流温度曲线,避免手工焊接长时间高温加热导致阻值漂移。
  • 清洗与防污染:高阻电路对焊剂残留敏感,必要时进行合适清洗并控制残留导电污染。
  • 存储:建议密封干燥、防潮包装保存,避免长期潮湿与腐蚀环境。

五、可靠性与验证

薄膜电阻具备良好机械与电气稳定性,建议在最终产品导入前进行温度循环、湿热与长期老化测试,确认阻值漂移在可接受范围内。量产时可抽样做四线测量、温度系数验证和焊接后测量确认一致性。

六、包装与替代型号

常见为卷带(Tape & Reel)供货,便于贴片机装配。若需更小封装或更高功率,可考虑同系列不同封装尺寸或同工艺的0603/1206 替代,选型时关注功率、稳定性与 TCR 匹配。

总结:AR05BTDW1002 以高精度、低温漂与宽温度适应性,适合要求严格的精密电子设计;合理的电路布局、降额使用与焊接控制可最大化其可靠性与性能表现。

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