WMSIC Electronic Components

Viking ARG05DTC5002

ModelARG05DTC5002
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05DTC5002
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05DTC5002
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.029g
Electronic Component
50kΩ
Electronic Component
1
Electronic Component
BM0263676897
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking ARG05DTC5002薄膜电阻产品概述

一、产品基本信息

Viking(光颉)ARG05DTC5002是一款0805封装的高精度薄膜固定电阻,属于光颉ARG系列核心产品。型号编码对应明确的技术参数逻辑:

  • ARG05:系列标识+0805封装代码;
  • D:精度等级(对应±0.5%);
  • T:温度系数特性(对应±25ppm/℃);
  • C:工艺优化标识;
  • 5002:阻值编码(50×10²Ω=50kΩ)。
    该产品针对小型化、高精度、宽温稳定需求设计,适配多领域电路应用。

二、核心技术参数

ARG05DTC5002的参数覆盖电路设计关键维度,具体如下:

类别 具体参数 备注 阻值与精度 50kΩ±0.5% 满足多数工业/消费电子误差要求 功率与电压 125mW(额定)、150V(最大工作电压) 适配小信号处理与中等电压电路 温度特性 ±25ppm/℃(TCR) 阻值温漂极小,宽温下稳定 工作温度范围 -55℃~+155℃ 工业级宽温,超商业级标准

三、关键性能特点

作为薄膜电阻,ARG05DTC5002具备以下核心优势:

  1. 高精度+低温漂:±0.5%精度与±25ppm/℃ TCR结合,确保电路阻值长期稳定,避免温变/老化导致的性能波动;
  2. 小型化适配:0805封装(2.0mm×1.2mm),支持高密度PCB布局,契合智能手机、可穿戴设备等小型化趋势;
  3. 宽温可靠性:-55℃~+155℃工作范围,可应对工业现场(如高温车间)、汽车辅助系统等极端温度场景;
  4. 低噪声特性:镍铬薄膜结构相比碳膜/金属膜,噪声更低,适合音频放大、信号调理等对噪声敏感的电路;
  5. SMT兼容性:表面贴装封装适配自动化生产,提高效率、降低制造成本。

四、适用应用场景

ARG05DTC5002因参数匹配性强,广泛覆盖以下领域:

  1. 工业控制:PLC模块、传感器接口、电机驱动辅助电路(需稳定阻值控制);
  2. 消费电子:智能手机PMU、音频电路、触控传感器(小型化+高精度需求);
  3. 通信设备:基站射频前端、路由器信号调理(宽温+低噪声需求);
  4. 汽车电子:车载信息娱乐系统、辅助驾驶传感器接口(覆盖-40℃~+125℃汽车级范围);
  5. 医疗仪器:监护仪、血糖仪信号处理(高精度+可靠性要求)。

五、封装与可靠性说明

  1. 封装规格:0805封装符合IPC标准,引脚间距与尺寸适配主流SMT设备,焊接可靠性高;
  2. 可靠性验证:经温湿度循环(-55℃+155℃,1000次)、振动(102000Hz,1g)等测试,满足工业级可靠性要求;
  3. 长期稳定性:薄膜电阻老化率≤0.1%/1000小时,可保障设备5年以上稳定运行。

ARG05DTC5002凭借“高精度、宽温稳定、小型化”的综合优势,成为多领域电路设计的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.