WMSIC Electronic Components

Viking AR05FTC4301

ModelAR05FTC4301
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR05FTC4301
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR05FTC4301
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.029g
Electronic Component
4.3kΩ
Electronic Component
1
Electronic Component
BM0264231379
Operating Temperature
55℃~+155℃
Operating Voltage
100V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR05FTC4301 产品概述

一、产品简介

AR05FTC4301 是 Viking(光颉)系列的高稳定性贴片薄膜电阻,阻值 4.3kΩ,精度 ±1%,额定功率 100mW,封装为国际通用 0805(≈2.0 × 1.25 mm)。该系列采用薄膜工艺制成,具有低温漂、噪声小和长期可靠性好的特点,适用于需要中高精度和优良温度稳定性的电子电路中。

主要参数一览:

  • 阻值:4.3kΩ
  • 精度:±1%
  • 额定功率:100 mW(基准温度参考 70°C)
  • 最高工作电压:100 V
  • 温度系数(TCR):±25 ppm/℃(典型上限)
  • 工作温度范围:-55℃ 至 +155℃
  • 封装:0805(2012 公制尺寸)

二、主要特性

  1. 高精度:±1% 阻值公差满足一般精密分压、阻抗匹配和滤波电路的需要。
  2. 优良温度稳定性:TCR ±25 ppm/℃,在温度变化环境中保持较小阻值漂移。
  3. 低噪声、低漂移:薄膜工艺本征噪声低,适合要求信号完整性的测量与放大电路。
  4. 宽温度范围:-55℃ 到 +155℃,适用于工业级及高温工作环境。
  5. 表面贴装 0805:兼容自动贴片和回流焊工艺,便于批量生产与装配。

三、典型应用

  • 精密仪器与测量设备(电压/电流采样、阻抗网络)
  • 信号处理与滤波网络(音频、模拟前端)
  • 电源管理(电压分压器、反馈网络)
  • 通信设备与基站(阻抗匹配、终端电阻)
  • 工业控制与传感器接口(要求稳定阻值与低温漂的场合)
    (如需用于汽车电子或医疗级别关键应用,请在采购前确认相关认证和资格)

四、电气与热性能说明

  • 额定功率是指在基准环境(通常 70°C)下的最大持续功耗;高温环境需进行功率降额。建议采用行业通用的降额规则:在 70°C 以上按线性方式降额至最高工作温度(155°C)时接近 0 W,以保证长期可靠性。
  • 最高工作电压 100 V:在高阻值及高电压场合仍能保持安全工作,但应注意电压与功耗共同作用下的热量管理与绝缘要求。
  • 温度系数 ±25 ppm/℃:适用于温度敏感的电路设计,可显著减少因环境温度变化导致的量测误差。

五、封装与工艺兼容性

  • 0805 封装尺寸(典型):2.0 mm × 1.25 mm,厚度约 0.45 mm,适配常见贴片生产线。
  • 兼容标准无铅回流焊工艺(Pb-free);建议的回流曲线遵循元器件行业通用规范(最大回流温度通常不超过 260℃,具体请参考工艺说明)。
  • 推荐 PCB 打样与焊盘尺寸请参照 0805 标准封装库,便于贴装偏差控制及锡膏印刷一致性。

六、可靠性与包装

  • 薄膜电阻工艺决定了产品在温度循环、湿热和长期工作下具有良好的稳定性与重复性。
  • 出厂提供防潮密封包装,常规包装方式为卷带(Tape & Reel),便于 SMT 自动贴装。具体卷带数量和包装形式可根据采购量和客户要求调整。
  • 储存与搬运:建议保持原包装并在干燥环境中存放,回流焊前遵守烘烤与防潮指引以避免焊接缺陷。

七、选型与注意事项

  • 若电路中存在瞬态高压或浪涌,应考虑电阻的瞬时功耗能力与热冲击承受力,必要时选用更大功率或并联/串联方案分散热量。
  • 对于极高精度或长期零漂苛刻的应用,可在设计阶段考虑预热老化或与配对电阻进行温度匹配。
  • 若需符合特定行业认证(如 AEC-Q200、医疗器械等级等),请在下单前与供应商确认相应的测试报告与认证文件。

如需产品样片、详细数据手册(含机械尺寸公差、焊接曲线与环境测试报告)或批量报价,请提供订购数量与用途场景,或直接联系 Viking(光颉)授权经销渠道获取更详细的技术支持。

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