WMSIC Electronic Components

Viking ARG03FTC4422

ModelARG03FTC4422
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03FTC4422
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03FTC4422
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
44.2kΩ
Electronic Component
1
Electronic Component
BM0264911640
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03FTC4422 0603封装薄膜电阻产品概述

一、产品核心定位与典型应用场景

ARG03FTC4422是Viking(光颉)推出的0603封装精密薄膜电阻,针对需要「小体积、高精度、宽温稳定」的电子电路设计,广泛覆盖以下场景:

  • 消费电子:智能手机、可穿戴设备的电源管理模块、音频前置放大电路(低噪声需求);
  • 工业控制:PLC模拟输入/输出模块、传感器信号调理电路(温度变化大的现场环境);
  • 通信设备:基站射频前端辅助电路、IoT终端传感器节点(高密度PCB设计);
  • 汽车电子:车载辅助电路(如胎压监测、车内温湿度传感器,需宽温适应)。

其核心优势是在紧凑封装下实现「1%精度+25ppm/℃温系」的平衡,兼顾性能与成本,适配中高端精密电路需求。

二、关键性能参数详解

ARG03FTC4422的参数围绕「精密稳定、适配小信号电路」设计,核心指标如下:

1. 阻值与精度

  • 标称阻值:44.2kΩ(符合E96系列精密阻值标准,避免非标准阻值的采购难度);
  • 精度等级:±1%(满足大多数模拟电路的分压、反馈、电流检测需求,无需额外校准);
  • 精度保持:工作温度范围内,阻值漂移远低于±1%(结合温系计算,全温区漂移仅约2.3Ω)。

2. 功率与电压能力

  • 额定功率:100mW(0603封装典型功率,适配小信号电路:传感器输出<1mW、运放电路<10mW);
  • 最大工作电压:75V(高于同封装厚膜电阻的50V,可应对工业24V~48V信号处理);
  • 过载耐受:短时间可承受1.5倍额定功率(150mW)或1.25倍额定电压(93.75V),适配电路瞬态波动。

3. 温度系数与温区

  • 温度系数(TCR):±25ppm/℃(薄膜电阻核心优势,比碳膜低8倍、厚膜低4倍);
  • 工作温区:-55℃~+155℃(覆盖寒冷地区户外设备低温、高功率设备附近高温);
  • 温漂验证:44.2kΩ在210℃温差下,最大漂移≈44.2k×210×25e-6≈2.32Ω,仅为标称值的0.005%。

4. 其他关键性能

  • 噪声水平:<0.1μV/√Hz(低噪声特性,适合音频、传感器电路);
  • 长期稳定性:1000小时老化后,阻值漂移<0.1%(符合工业级可靠性标准)。

三、封装与工艺优势

ARG03FTC4422采用0603英制封装(公制1608,尺寸1.6mm×0.8mm×0.45mm),结合薄膜工艺具备以下优势:

1. 小体积适配高密度设计

0603封装是消费电子、IoT设备主流小封装,1cm² PCB可布局约400个电阻,大幅提升电路集成度(如智能手机主板电源管理IC周边)。

2. 薄膜工艺的性能突破

采用镍铬合金薄膜(NiCr) 工艺,相比厚膜电阻(印刷浆料):

  • 阻值精度更高(易实现±1%及以下);
  • 温系更稳定(合金薄膜均匀性优于浆料);
  • 噪声更低(薄膜结构减少电流波动);
  • 长期可靠性更强(无浆料烧结的不稳定因素)。

3. 焊接与生产适配性

贴片封装支持回流焊工艺,焊接可靠性符合IPC标准,适合自动化批量生产,降低组装成本。

四、品牌与质量保障

ARG03FTC4422由Viking(光颉)生产,该品牌是台湾老牌被动元件厂商,专注电阻研发30余年,产品具备:

  • 环保认证:符合RoHS 2.0、REACH标准,无铅无镉;
  • 质量体系:通过ISO 9001(质量)、ISO 14001(环境)认证;
  • 供应能力:年产能充足,满足中小批量到大规模量产;
  • 技术支持:提供样品与电路验证服务,加速客户设计落地。

五、总结

ARG03FTC4422是一款高性价比的0603精密薄膜电阻,在紧凑体积下实现「1%精度+25ppm/℃温系+宽温适应」,适配消费电子、工业控制、通信等领域的中高端电路设计。其稳定性能、可靠质量与Viking品牌保障,使其成为替代同类进口产品的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.