WMSIC Electronic Components

VBsemi FR3505-VB FR3505

ModelFR3505-VB
PackageTO-252
BrandVBSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VBsemi FR3505-VB
Type
VBSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VBSEMI
Electronic Component
FR3505-VB
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.369g
Electronic Component
1
Electronic Component
BM0227783198
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
136W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FR3505-VB 产品概述

一、概述

FR3505-VB 是 VBsemi(微碧半导体)推出的一款高性能 N 沟道功率场效应晶体管,耐压等级为 60V,适用于中低电压、高电流的开关和功率处理场景。器件采用 TO-252(DPAK)封装,结合低导通电阻与较大的电流承载能力,适合用于降压转换、同步整流、电源管理和功率开关等应用。

二、主要电气参数

  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:58A(器件额定);典型设计中常以 50A 等级参考系统设计裕量
  • 导通电阻 RDS(on):10 mΩ @ Vgs = 10V
  • 耗散功率 Pd:136W(器件额定条件下)
  • 阈值电压 Vgs(th):2.0V @ Id = 250 μA
  • 总栅极电荷 Qg:47 nC @ Vgs = 10V
  • 输入电容 Ciss:2.65 nF
  • 反向传输电容 Crss:225 pF
  • 输出电容 Coss:470 pF
  • 工作结温范围:-55 ℃ ~ +175 ℃
  • 封装:TO-252(DPAK)
  • 器件类型:N 沟道功率 MOSFET

三、特性亮点

  • 低 RDS(on)(10 mΩ@10V)可显著降低导通损耗,适合高电流路径以提高效率。
  • 较高的连续漏极电流能力(58A)与较高耗散功率(136W)使其在紧凑封装下仍具备良好的瞬态和稳态承载能力。
  • 较大的栅极电荷(47 nC)与中等输入电容表明器件在开关速度与驱动能耗之间取得平衡,适用于需要兼顾效率和 EMI 的设计。
  • 宽工作结温(-55℃ 至 +175℃)有助于在高温或严苛环境中保持可靠性。

四、典型应用场景

  • 同步降压转换器(Synchronous Buck)功率开关与整流器
  • 开关电源与电源管理模块(PMIC)
  • 电机驱动(中小功率)及功率分配开关
  • 车载与工业电源应用(注意系统热管理与符合 60V 耐压)
  • 负载开关与保护电路

五、设计与使用建议

  • 栅极驱动:由于 Qg = 47 nC(@10V),建议使用能够提供足够电流的栅极驱动器以保证快速切换,降低开关损耗与热应力。驱动电压优先采用 10V 以达到标称 RDS(on)。
  • PCB 热管理:TO-252 封装下,建议在 PCB 上使用大面积散热铜箔和多层过孔增加热传导;并确保器件附近为低阻抗电流回路以减少寄生电感。
  • 并联使用:若需并联以提升电流承载能力,应保证良好的驱动一致性与对称的 PCB 布局,避免因热漂移导致电流不均衡。
  • 开关速度与 EMI:Crss(225 pF)与 Coss(470 pF)会影响反向恢复与开关过渡,必要时采用缓冲、RC 限流或斜率控制以降低 EMI 与尖峰电压。
  • 安全与可靠性:在高温或连续高负载条件下注意器件结温控制,遵循厂家数据手册中的最大结/环境温度和功耗指南。

六、封装与采购信息

  • 封装:TO-252(DPAK),适合表面贴装与散热要求中等的功率应用。
  • 品牌:VBsemi(微碧半导体)。
  • 型号:FR3505-VB。采购与替换时请参考完整的数据手册以确认引脚定义、最大额定值及典型特性曲线。

总结:FR3505-VB 以 60V 耐压、低 RDS(on) 与高电流能力为核心优势,在需要兼顾导通损耗与开关性能的中功率设计中具备很高的实用价值。合理的驱动策略与热管理是发挥其性能与确保可靠性的关键。若需更精确的瞬态损耗、热阻及 SOA(安全工作区)数据,请参考厂方完整技术资料。

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