Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
VBsemi VBI2658
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VBsemi VBI2658
- Type
- VBSEMI
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- VBSEMI
- Electronic Component
- VBI2658
- Electronic Component
- 1
- Package
- SOT-89
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.146g
- Electronic Component
- 1
- Electronic Component
- BM0223192558
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 10.4W
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
- Voltage(Vdss)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
VBI2658 产品概述
品牌: 微碧半导体 (VBsemi)
封装类型: SOT-89
1. 产品概述
VBI2658 是一款高性能的双极型晶体管，专为低功耗应用而设计。其采用 SOT-89 封装，具备小型化和高效散热性能，使其非常适合现代电子设备中使用。VBsemi 的 VBI2658 提供了优秀的电流放大能力和较低的饱和电压，广泛应用于开关电源、音频放大器和信号放大器等场合。
2. 封装特点
SOT-89 (小外形晶体管封装) 是一种表面贴装封装，具有体积小、引脚数少和易于安装的优点。其尺寸通常为 2.6mm x 3mm x 1.0mm，提供紧凑的解决方案，适合空间有限的电子电路设计。SOT-89 封装的散热性能良好，适合要求较高的工作电流及散热管理的应用。
3. 电气性能
VBI2658 具备多项出色的电气特性，包括：
- 最大电流: 通常可支持高达 500mA 的持续工作电流，这使其能够支持多种负载应用。
- 电压范围: VBI2658 的工作电压范围通常达到 40V，适合用于高电压环境。
- 增益: 该器件具有较高的直流电流增益 (hFE)，通常在 100 到 450 之间，可用于各种放大电路，提高信号的放大效果。
- 开关速度: 由于其结构设计，VBI2658 提供极低的开关延迟，提高了开关电路的响应速度，适合快速开关应用。
4. 应用场景
VBI2658 由于其优良的性能，适用于多种应用场景，包括但不限于：
- 消费电子: 在音频设备、电视和音响设备中作为音频放大器的核心元件，增强信号的质量。
- 工业控制: 在传感器、执行器和其他控制设备的输入和输出接口中，进行信号调节和放大。
- 开关电源: 可以作为开关元件用于DC-DC转换器中，提高电源的效率和稳定性。
- 汽车电子: 在汽车音响系统材料中用于功率放大及信号处理，提高音质表现和系统稳定性。
5. 优势与特点
VBI2658 集成了多种优秀的性能特点，使其在众多竞争产品中脱颖而出：
- 高效能: 优异的电流增益与低饱和电压结合，使得在低功耗与高性能之间取得良好平衡，减少电能的损耗。
- 可靠性: VBsemi 的产品经过严格的测试与筛选，确保其在各种工作环境中的稳定性与长期耐用性。
- 广泛的适用性: 从消费电子到工业应用，VBI2658 的广泛应用场景使其成为设计师和工程师的首选元件。
6. 总结
VBI2658 是一款多功能、高性能的双极型晶体管，结合了微碧半导体在半导体技术领域的深厚积累，其 SOT-89 封装设计为现代设备提供了理想的体积与性能比。无论是在高效开关应用还是 audio Amplifying 方面，VBI2658 的出色表现都能为开发者提供强有力的支持。如果您正在寻求可靠性与效率兼备的解决方案，VBI2658 是一个值得考虑的优秀选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
