WMSIC Electronic Components

VBsemi HUF75321D3ST-VB HUF75321D3ST

ModelHUF75321D3ST-VB
PackageTO-252
BrandVBSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VBsemi HUF75321D3ST-VB
Type
VBSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VBSEMI
Electronic Component
HUF75321D3ST-VB
Electronic Component
1
Package
TO-252
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.39g
Electronic Component
1
Electronic Component
BM0230496792
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
100W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HUF75321D3ST-VB 产品概述

一、产品简介

HUF75321D3ST-VB 是微碧半导体(VBsemi)推出的一款高性能 N 沟道功率场效应管,耐压 60V,适用于中功率开关与电源管理场合。器件采用 TO-252(DPAK)表面贴装封装,工作温度范围宽(-55℃ 至 +175℃),适应严苛环境与工业级应用需求。

二、主要参数

  • 漏源耐压(Vdss):60V
  • 连续漏极电流(Id):标称可达 45A(部分规范或应用文档中也有保守值 35A)
  • 导通电阻(RDS(on)):25mΩ @ Vgs=10V;30mΩ @ Vgs=4.5V
  • 耗散功率(Pd):100W(散热条件限制下)
  • 阈值电压(Vgs(th)):2V @ ID=250µA
  • 总栅极电荷(Qg):11nC @ Vgs=10V
  • 输入电容(Ciss):1.5nF;输出电容(Coss):140pF;反向传输电容(Crss/Crss):60pF
  • 封装:TO-252(DPAK)
  • 工作温度:-55℃ ~ +175℃

三、特性与优势

  • 低导通阻抗:在 10V 驱动下 RDS(on) 仅 25mΩ,有利于降低导通损耗和提高效率。
  • 中等栅极电荷:11nC 的 Qg 在驱动器设计上平衡了开关速度与驱动功耗,适合常见驱动电路或驱动芯片。
  • 宽温度范围与高功率耗散:-55℃~+175℃ 的额定温度与 100W 的耗散能力,使其在工业、电源模块与电机驱动中表现可靠。
  • 封装工艺成熟:TO-252 便于 SMT 组装与热量通过 PCB 散出,适合批量生产与模块化设计。

四、典型应用场景

  • DC-DC 降压/升压变换器(同步整流或开关器件)
  • 电源管理、负载开关与电子继电器替代
  • 电机驱动下的半桥/全桥级(中等电流场合)
  • 汽车电子(非发动机重要子系统)、工业控制与消费类电源适配器

五、封装与热管理建议

  • 虽然器件 Pd 达到 100W,但实际耗散受 PCB 走线与散热铜面积影响较大。推荐在 PCB 底层和散热区增加大面积铜箔并使用过孔导热至散热层。
  • 在高频开关应用中,保持引脚到驱动器/感应元件的走线最短,减小寄生电感与环路面积,以降低开关振铃与 EMI。
  • 对于长期高温工作,应基于结温限制计算允许的平均电流并考虑散热器或风冷方案。

六、使用注意事项

  • 驱动电压选择:若驱动电压只能到 4.5V,应按 30mΩ 的 RDS(on) 计算导通损耗;推荐在需要最低导通损耗时采用 10V 驱动。
  • 开关损耗评估:Qg=11nC,开关频率较高时需关注驱动能量消耗与驱动器发热。
  • 保护措施:建议在应用中加入合理的短路、过流与过温保护,以避免瞬态冲击导致的器件失效。

总结:HUF75321D3ST-VB 综合了低导通损耗、适中栅极电荷和宽温高功率耗散能力,适合中功率开关电源与工业驱动场合。设计时需重视 PCB 散热与驱动匹配,以发挥器件最佳性能。

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