WMSIC Electronic Components

VBsemi AO3400-VB AO3400

ModelAO3400-VB
PackageSOT-23(TO-236)
BrandVBSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VBsemi AO3400-VB
Type
VBSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VBSEMI
Electronic Component
AO3400-VB
Electronic Component
1
Package
SOT-23(TO-236)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.054g
Electronic Component
1
Electronic Component
BM0265842982
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AO3400-VB N沟道MOS场效应管产品概述

AO3400-VB是VBsemi微碧半导体推出的一款高性能N沟道增强型MOSFET,采用紧凑的SOT-23表面贴装封装,针对低电压、大电流场景优化设计,具备低导通损耗、快速开关响应等核心优势,广泛适用于便携电子、电源管理等领域。

一、产品基本信息

  • 品牌:VBsemi(微碧半导体)
  • 型号:AO3400-VB
  • 类型:N沟道MOS场效应管
  • 封装形式:SOT-23(小型表面贴装封装,尺寸紧凑)
  • 核心定位:低电压大电流应用的高效开关器件,兼顾效率与空间利用率

二、核心电气参数解析

AO3400-VB的参数设计平衡了导通损耗与开关性能,关键参数如下:

  1. 电压与电流能力:漏源击穿电压(Vdss)为30V,可覆盖常见低电压系统(5V、12V);连续漏极电流(Id)达6.5A,支持中等功率负载驱动(如小型电机、电池负载)。
  2. 低导通电阻(RDS(on)):在栅源电压(Vgs)为10V时,导通电阻仅30mΩ;即使在Vgs=4.5V(主流MCU逻辑电平)下,RDS(on)也低至33mΩ——导通压降小、损耗低,能有效提升系统效率,减少发热。
  3. 快速开关特性:栅极电荷量(Qg)仅4.5nC(Vgs=10V时),配合低输入电容(Ciss=335pF)、反向传输电容(Crss=17pF),开关速度快,适合高频应用(如DC-DC转换器)。
  4. 阈值与功耗:阈值电压(Vgs(th))为1.1V(Id=250uA时),与多数MCU逻辑电平兼容;最大耗散功率(Pd)为1.1W,满足小型系统功率需求。
  5. 宽温适应性:工作结温范围为-55℃~+150℃,覆盖工业级与消费电子的宽环境温度,极端环境下性能稳定。

三、关键性能优势

AO3400-VB针对实际场景做了针对性优化,核心优势包括:

  1. 低损耗高效能:低导通电阻减少大电流负载下的功率损耗,尤其适合电池供电设备(如智能穿戴),延长续航时间。
  2. 快速开关响应:小栅极电荷与低电容参数提升开关速度,减少开关过程中的能量损耗,适配高频DC-DC转换、负载开关等场景。
  3. 宽温可靠稳定:-55℃~+150℃的结温范围,能适应户外设备、工业控制等极端温度环境,降低温度波动对性能的影响。
  4. 小封装高密度:SOT-23封装尺寸紧凑(约2.9mm×1.6mm×1.1mm),适合便携电子(智能手机、智能手环)的高密度PCB设计,节省空间。

四、典型应用场景

AO3400-VB凭借参数优势,广泛应用于以下领域:

  1. 便携电子设备:智能手机、平板电脑、智能穿戴的电源管理模块(电池保护、负载开关)。
  2. 低电压DC-DC转换器:5V/12V转3.3V/5V的同步降压转换器,支持中等电流输出。
  3. 负载开关电路:电池供电系统的负载通断控制,实现低功耗待机。
  4. 小型电机驱动:玩具电机、小型风扇、微型泵的驱动电路,满足低电压大电流需求。
  5. PMIC辅助控制:配合电源管理IC(PMIC)实现多路电源开关,提升系统集成度。

五、封装与可靠性说明

SOT-23封装为表面贴装设计,适合自动化生产,焊接可靠性高;器件符合RoHS环保标准,无铅无卤,满足绿色制造要求。其宽温度范围与低损耗特性,确保长期使用中性能稳定,降低系统维护成本。

总结:AO3400-VB是一款性价比突出的N沟道MOSFET,适合低电压大电流、对效率与空间要求严格的应用场景,是便携电子、电源管理领域的理想选择。

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