WMSIC Electronic Components

VBsemi SI2323CDS-T1-GE3-VB SI2323CDS

ModelSI2323CDS-T1-GE3-VB
PackageSOT-23(TO-236)
BrandVBSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VBsemi SI2323CDS-T1-GE3-VB
Type
VBSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VBSEMI
Electronic Component
SI2323CDS-T1-GE3-VB
Electronic Component
1
Package
SOT-23(TO-236)
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.054g
Electronic Component
1
Electronic Component
BM0265842971
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.6W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2323CDS-T1-GE3-VB P沟道MOSFET产品概述

SI2323CDS-T1-GE3-VB是**VBsemi(微碧半导体)**推出的一款小型化P沟道MOS场效应管,采用经典SOT-23(TO-236)贴片封装,主打低压、低损耗、高集成度的应用场景。其核心参数均衡,兼顾导通电阻、电流能力与驱动便利性,适合便携式电子、电池管理、低压开关等多种场景,是同类产品中性价比突出的选择。

一、核心参数总览

这款MOSFET的关键参数可分为电气特性、电容特性、功率与温度三类,具体如下:

1. 电气核心参数

  • 漏源电压(Vdss):最大30V,适配12V、24V等低压直流系统(需留余量);
  • 连续漏极电流(Id):5.6A(结温Tj≤25℃时),在SOT-23小封装中表现亮眼,满足中小功率负载需求;
  • 导通电阻(RDS(on)):46mΩ@Vgs=10V、54mΩ@Vgs=4.5V、49mΩ@Vgs=6V——不同栅源电压下导通电阻差异小,适配多驱动电压;
  • 阈值电压(Vgs(th)):仅500mV,远低于常规MOSFET的1V阈值,驱动门槛极低;
  • 耗散功率(Pd):1.6W(Tj=25℃时),支持持续小功率负载运行。

2. 电容特性

  • 输入电容(Ciss):1.295nF@Vgs=15V,反映栅极输入阻抗;
  • 反向传输电容(Crss):130pF@Vgs=15V,影响开关速度与噪声;
  • 输出电容(Coss):150pF@Vgs=15V,关系输出端充放电损耗。

3. 温度与可靠性

  • 工作结温范围:-55℃~+150℃,覆盖工业级与消费级宽温度场景,低温性能稳定。

二、关键性能优势

从参数可提炼出三大核心优势,适配多数低压应用需求:

1. 低导通损耗,效率优先

导通电阻(RDS(on))是衡量MOSFET损耗的核心指标——SI2323CDS-T1-GE3-VB的46mΩ@10V导通电阻,在同封装产品中处于上游水平。即使在4.5V(常见低压逻辑)下,54mΩ的导通电阻也能有效降低负载电流热损耗,适合对电源效率敏感的便携式设备(如无线耳机、智能手环)。

2. 低阈值驱动,兼容性强

500mV的阈值电压(Vgs(th))是核心亮点:不仅支持3.3V、5V常规逻辑电平直接驱动,甚至在2.5V低压系统中也能可靠导通,无需额外驱动电路,简化设计、降低BOM成本。

3. 小封装高集成,适配便携场景

SOT-23封装尺寸仅约2.9×1.6×1.1mm,体积小巧,可贴装在高密度PCB上,完美适配智能手机、智能穿戴等空间严苛的产品;同时5.6A连续电流能力,让其在小封装中实现“大电流承载”,无需牺牲性能换体积。

三、典型应用场景

结合参数与优势,这款MOSFET的主要应用方向包括:

1. 便携式电子电源管理

  • 电源路径开关:智能手机电池充放电控制、无线耳机充电盒电源切换;
  • 负载开关:控制小型外设(摄像头、传感器)通断,低损耗减少待机功耗。

2. 电池保护与管理

  • 过充/过放保护开关:锂电池组充放电回路控制,5.6A电流满足多数消费级电池需求;
  • 均衡电路开关:辅助电池单体电压均衡,低损耗不影响电池效率。

3. 低压直流开关与驱动

  • 12V/24V系统开关:智能家居小功率家电(LED灯、小型风扇)控制;
  • 小型电机驱动:微型直流电机(玩具电机、小型水泵)启停控制,开关速度适配低速应用。

4. 工业低压信号切换

  • 宽温环境适配:户外设备(智能电表、安防摄像头)低压信号开关,可靠性符合工业级要求。

四、总结

SI2323CDS-T1-GE3-VB是一款小体积、低损耗、易驱动的P沟道MOSFET,核心参数平衡了电流能力、导通电阻与驱动门槛,适配从消费级便携式设备到工业级低压系统的多种场景。VBsemi的品牌可靠性与SOT-23封装的高集成度,让其成为同类应用中“性能与成本兼顾”的优选器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.