WMSIC Electronic Components

VBsemi SI9948AEY-T1-E3-VB SI9948AEY

ModelSI9948AEY-T1-E3-VB
PackageSO-8
BrandVBSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VBsemi SI9948AEY-T1-E3-VB
Type
VBSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VBSEMI
Electronic Component
SI9948AEY-T1-E3-VB
Electronic Component
1
Package
SO-8
Electronic Component
2 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.136g
Electronic Component
1
Electronic Component
BM0265598705
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
4W
Electronic Component
Electronic Component
Electronic Component
4000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI9948AEY-T1-E3-VB P沟道MOSFET产品概述

SI9948AEY-T1-E3-VB是**VBsemi(微碧半导体)**推出的一款双管P沟道MOSFET,专为中压、中功率场景设计,兼具低导通损耗、快速开关特性与宽温可靠性,广泛适配便携设备、电源管理等领域的电路需求。

一、核心电气参数总览

该产品的关键参数明确了应用边界与性能定位,核心参数如下:

  • 电压规格:漏源击穿电压(V_{DSS}=60V),满足12V、24V等低压/中压系统需求;栅极阈值电压(V_{GS(th)}=3V)(测试条件:(I_{DS}=250μA)),兼容3.3V、5V等主流控制逻辑电平。
  • 电流与功率:连续漏极电流(I_D=5.3A),可稳定驱动中等功率负载;最大耗散功率(P_D=4W),配合封装散热能力满足连续工作需求。
  • 导通电阻:(R_{DS(on)})表现优异——(\boldsymbol{54mΩ@V_{GS}=10V})、(\boldsymbol{60mΩ@V_{GS}=4.5V}),低导通电阻直接降低损耗,减少电路发热。
  • 开关特性:栅极总电荷量(Q_g=32nC)((V_{GS}=10V)),输入电容(C_{iss}=1.345nF)、反向传输电容(C_{rss}=180pF),电容参数合理,开关速度快。
  • 温度范围:工作温度覆盖(\boldsymbol{-55℃~+150℃}),满足工业级、户外设备的宽温可靠性要求。

二、关键性能特点解析

从参数延伸出的性能优势,是适配多场景的核心:

  1. 低损耗高效能:低(R_{DS(on)})是最大亮点,即使在4.5V低栅极电压下仍保持60mΩ,3.3V系统也能实现低损耗,提升电源转换效率。
  2. 宽逻辑兼容:3V阈值电压适配MCU、FPGA的控制输出,无需额外电平转换,简化电路设计。
  3. 快速开关响应:(Q_g)与电容参数控制合理,开关延迟小,支持kHz级高频应用(如DC-DC转换器),减少开关损耗。
  4. 宽温可靠运行:-55℃至150℃的范围,覆盖工业低温(北方户外)与高温(电源模块内部)场景,器件稳定性有保障。
  5. 双管集成设计:SOP-8封装内置2个独立P沟道MOSFET,相比单管节省约50% PCB面积,适合便携设备紧凑布局。

三、封装与可靠性设计

  1. SOP-8封装优势:贴片式封装适配自动化生产,引脚间距合理,散热路径清晰,可有效导出4W耗散功率,避免局部过热。
  2. 可靠性保障:60V击穿电压留有充足余量(多数应用电压低于60V),降低过压损坏风险;宽温设计经过老化测试,确保极端环境长期稳定。

四、典型应用场景

结合性能参数,该产品主要适用于:

  1. 便携设备电源管理:智能手机、移动电源的充电/放电控制,低损耗减少电池发热,延长续航。
  2. 低压DC-DC转换器:12V转5V、24V转12V的buck/boost电路,作为高端/低端开关提升效率。
  3. 负载开关电路:控制LED背光、小型传感器等中等功率负载通断,5.3A连续电流满足需求。
  4. 电池保护电路:锂电池过充、过放、过流保护模块,宽温特性适配户外储能设备。
  5. 小型电机驱动:玩具电机、小型风机的正反转控制,快速开关实现平稳调速。

五、VBsemi品牌与选型优势

VBsemi作为国内成熟半导体厂商,产品具备:

  • 高性价比:相比进口同类产品价格更具竞争力,适合量产项目控本。
  • 一致性好:生产工艺稳定,参数离散性小,降低电路调试难度。
  • 供货稳定:产能储备充足,满足批量订单需求。
  • 技术支持:提供完善datasheet与应用参考电路,助力快速落地设计。

总结

SI9948AEY-T1-E3-VB是一款定位清晰的双管P沟道MOSFET,以低导通损耗、宽温可靠、集成化设计为核心优势,覆盖便携设备、电源管理等多领域中功率应用。对于追求高效、省空间、高可靠性的电路设计,是理想选型方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.