WMSIC Electronic Components

VBsemi SI9933ADY-T1-E3-VB SI9933ADY

ModelSI9933ADY-T1-E3-VB
PackageSOP-8
BrandVBSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
VBsemi SI9933ADY-T1-E3-VB
Type
VBSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VBSEMI
Electronic Component
SI9933ADY-T1-E3-VB
Electronic Component
1
Package
SOP-8
Electronic Component
2 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.287g
Electronic Component
1
Electronic Component
BM0265006195
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.5W
Electronic Component
Electronic Component
Electronic Component
4000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI9933ADY-T1-E3-VB 产品概述

一、核心参数概览

SI9933ADY-T1-E3-VB 为双通道 P 沟道功率 MOSFET,单器件包含两个独立 P‑Channel。主要电气参数如下:

  • 漏源耐压 Vdss:30 V(P 沟道器件,标称耐压 -30 V)
  • 连续漏极电流 Id:7.3 A(单通道)
  • 导通电阻 RDS(on):35 mΩ @ VGS = -10 V;约 40 mΩ @ VGS = -4.5 V
  • 栅阈电压 VGS(th):典型范围约 -1 ~ -3 V(|Vth| ≈ 1 V 量级)
  • 总栅极电荷 Qg:15 nC @ 4.5 V
  • 输入/输出/反向电容:Ciss = 1.35 nF,Coss = 215 pF,Crss = 185 pF
  • 功耗 Pd:2.5 W(SOP‑8 封装散热受限)
  • 工作温度:-55 ℃ ~ +150 ℃

二、器件特点与优势

  • Trench 工艺硅片(台积电流片)保证了较低的导通电阻与稳定的热特性,适合高功率开关应用。
  • 双通道集成在 SOP‑8 小封装内,便于在高密度电路板上实现高侧开关或两路并行/冗余设计。
  • 较低的总栅极电荷(15 nC @4.5 V)与中等寄生电容,兼顾开关速度与驱动能耗,适用于频率不极高的功率转换场合。
  • 封装由长电科技(Changjiang)处理,器件品牌为 VBsemi(微碧半导体),可用于汽车与工业级别要求较高的场合。

三、典型应用场景

  • 高侧开关与电源管理:电池供电设备、电源分配开关。
  • 电机驱动与电机控制模块(作为并联或高侧隔离元件)。
  • 汽车电子子模块中低/中功率开关应用(需按车规级要求做额外验证)。
  • LED 驱动与照明模块中的高侧恒流或开关控制。

四、设计与使用建议

  • 作为 P 沟道器件,常用于高侧开关以降低驱动复杂度;注意栅极驱动需给出合适的负向 VGS(相对源极)。
  • 在 VGS = -4.5 V 下 RDS(on) 与 Qg 性能均衡,适用于驱动电压受限时的设计折中。若能提供 -10 V 驱动,可获得最低导通损耗。
  • SOP‑8 封装 Pd 为 2.5 W,布局时需考虑铜箔散热、器件间距及热回流路径,必要时并联两通道或增加散热片以减小结温。
  • 在开关速度、EMI 与效率之间权衡时,可通过门极电阻与软切换策略降低尖峰与发热。

五、封装与可靠性

  • 封装:SOP‑8 表面贴装,适合自动化贴装与回流焊工艺。
  • 环境与可靠性:工作温度范围宽(-55 ~ +150 ℃),适合工业与部分车规场合;但若在车规级关键位置使用,建议做完整的汽车级验证与应力测试。

总结:SI9933ADY‑T1‑E3‑VB 为一款面向高侧开关与中等功率场景的双通道 P 沟道 MOSFET,具有低 RDS(on)、合理的驱动电荷与紧凑 SOP‑8 封装,适合电源管理、LED 驱动与电机控制等应用。

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