Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WSB5503W-2/TR 是由韦尔半导体(WILLSEMI)出品的一款肖特基二极管,具有良好的电气特性和优异的性能,封装采用 SOD-323。此款二极管特别设计用于高频、高效率的电子电路,广泛应用于开关电源、整流电路以及电源管理设备中。
正向电压降:在 1A 的工作条件下,WSB5503W-2/TR 的正向电压降约为570mV。较低的正向压降使得该二极管能够有效降低功耗,提高整体系统的能效。
反向耐压:该二极管具有高达40V的反向耐压能力,使其能够适应多种不同的应用场景,尤其是在需要处理相对高电压的环境下。
额定电流:WSB5503W-2/TR 的最大持续正向电流为1A,适合于多数中小功率的电源应用。
封装类型:SOD-323 封装设计使其具有较小的尺寸和优秀的散热性能,能够方便地集成到各种现代电子产品中。
高效能:由于其肖特基特性,WSB5503W-2/TR 在正向导通时可以提供较低的电压降,减少导通损耗,从而提高了整体电源的效率。
高速度和低反向恢复:肖特基二极管的反向恢复时间非常短,适合高频应用,能够有效降低开关损耗,特别是在开关电源和逆变器等高速开关电路中表现优异。
宽温工作范围:WSB5503W-2/TR 的工作温度范围较广,能够在不同环境条件下稳定工作,提高了产品的适应性,适用于消费电子、工业设备等各种应用场合。
优异的热管理:SOD-323 封装提供了良好的热传导性能,能有效地散热,确保二极管在高负载情况下仍能保持稳定的工作状态。
WSB5503W-2/TR 适用于如下多个应用场景:
开关电源:在高效能开关电源中,能够有效降低损耗,提高转换效率。
电源管理:广泛用于电源管理芯片中,承受快速开关特性,能够提供高可靠性的整流和保护。
高频应用:如 RF 放大器和混频器中,能够处理高速信号,保证信号完整性。
车载电子:在汽车电子中,尤其是用于电源输入和逆变器部分,能够承受严苛的工作环境。
消费电子:如手机、平板电脑及其他便携式设备中,能够减少能耗,延长电池使用时间。
WSB5503W-2/TR 是一款高性能的肖特基二极管,凭借其低正向压降、高反向耐压及优良的热管理性能,使其成为众多现代电子电路中不可或缺的组件。其广泛的应用范围和高适应性,使得它在电源管理和开关电源等领域有着极为重要的地位。对于要求高效能和高可靠性的应用,WSB5503W-2/TR 提供了理想的解决方案。无论是在工业应用还是消费电子产品中,韦尔半导体的这款产品都能够有效提升整体产品的性能与效能。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products