WMSIC Electronic Components

WILLSEMI ESD73011N-2/TR ESD73011N

ModelESD73011N-2/TR
PackageDFN1006-2L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI ESD73011N-2 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD73011N-2/TR
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.4pF
Electronic Component
BM0257641541
Operating Temperature
40℃~+85℃
Voltage
8.5V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD73011N-2/TR 产品概述

一、产品简介

ESD73011N-2/TR 是由WILLSEMI(韦尔半导体)公司推出的一款高性能ESD(静电放电)保护二极管。该元件专门设计用于保护敏感电子设备免受静电放电和其他瞬态电压的影响,具有优良的过压保护能力和低电容特性,广泛应用于智能手机、平板电脑、消费电子、工业设备及各种汽车电子系统中。

二、封装与特性

ESD73011N-2/TR 采用DFN1006封装,这种小型化的封装形式很适合高密度的电子产品设计。其封装尺寸为1.0mm x 0.6mm,非常适合于空间受限的应用。DFN封装不仅提供了优良的热性能和电气性能,同时还利于自动化生产和焊接工艺的实现。

三、静电保护性能

ESD73011N-2/TR具备出色的ESD保护能力,符合IEC61000-4-2标准。在与人接触的情况下,该组件能在不同的接触和空气放电模式下承受最高±8kV的静电放电。此特性确保了其在真实环境下的高可靠性,对于敏感IC和数据线等设备提供了高效的保护。

四、电气特性

  1. 低钳位电压:ESD73011N-2/TR具有较低的钳位电压,这意味着在遭受瞬态过压时,能够有效控制电压峰值,保护后端电路不受损害。
  2. 低泄漏电流:在正常工作条件下,ESD73011N-2/TR的泄漏电流非常低,这有助于延长设备的整体使用寿命,并提高系统的能效。
  3. 低电容:其电容值较低,有效减少了在高速数据传输中信号失真,确保了稳定的信号完整性。

五、应用场景

ESD73011N-2/TR适用于多种应用,主要包括但不限于:

  • 智能手机和移动设备:保护触屏、传感器、USB接口等敏感元件,确保设备在高频使用中的稳定性。
  • 消费者电子产品:如电视机、音响系统、路由器等,能够防止因静电放电引起的数据丢失或设备损坏。
  • 汽车电子:在车载娱乐系统、传感器和通信模块中,提供必要的静电保护,保障安全可靠运行。
  • 工业设备:在自动化控制系统和边缘计算设备中,保护重要信号路径不受瞬态电压的干扰。

六、总结

ESD73011N-2/TR结合了出色的静电保护性能、低电压钳位、低泄漏电流以及小型化封装,使其成为现代电子产品中不可或缺的保护组件。随着电子产品朝着更小型、更高性能的方向发展,选择合适的ESD保护二极管显得尤为重要。WILLSEMI(韦尔半导体)以其强大的研发与制造能力,致力于为客户提供高质量的电子元器件,以满足市场的多样化需求。ESD73011N-2/TR显然是满足这些需求的优秀选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.