Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
WILLSEMI WNM3013-3/TR WNM3013
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WILLSEMI WNM3013-3 / TR
- Type
- WILLSEMI
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WILLSEMI
- Electronic Component
- WNM3013-3/TR
- Electronic Component
- 1
- Package
- SOT-723
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.014g
- Electronic Component
- 1
- Electronic Component
- BM69417260
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 380mW
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
- Voltage(Vdss)
- 50V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：WNM3013-3/TR N沟道MOSFET
一、引言
在现代电子设备中，场效应管（MOSFET）作为一种重要的开关和放大元件，广泛应用于功率管理、信号调理、开关电源和自动化控制等场合。本产品WNM3013-3/TR是由WILLSEMI（韦尔）公司生产的一款高性能 N沟道 MOSFET，具有380mW的功率处理能力，50V的击穿电压和250mA的漏电流，采用SOT-723封装，极具市场竞争力。
二、基本规格
- 产品名称：WNM3013-3/TR
- 类型：N沟道MOSFET
- 最大功率：380mW
- 最大漏电压：50V
- 最大漏电流：250mA
- 封装类型：SOT-723
- 品牌：WILLSEMI（韦尔）
三、产品特性
高功率处理能力 WNM3013-3/TR能够支持高达380mW的功率处理，这使得其在各种应用中都能实现高效工作，包括开关电源、LED驱动等。
较高的击穿电压 最大漏电压达到50V，使得该MOSFET适用于较高电压的应用场合，同时提高了系统的可靠性和安全性，避免元件在过电压工作时发生击穿。
适中的漏电流 250mA的最大漏电流适用于大多数低功率管理场合，支持较高的开关频率下的工作，满足了客户对效率与性能的兼顾要求。
小型封装（SOT-723） SOT-723封装使得WNM3013-3/TR非常适合于小型化设计的电子产品，如便携设备、消费电子、工业控制等，有助于节省PCB空间并简化电路设计。
高效的开关特性 作为N沟道MOSFET，WNM3013-3/TR在通态导通时具有较低的导通电阻，能够有效提升开关效率，减少功耗。这一点在高频开关应用中尤为重要。
四、应用场景
WNM3013-3/TR的特性使其适应了多种应用场景，包括但不限于：
- 开关电源：可作为主开关元件，提供高效、稳定的电源输出；
- LED驱动电路：适合用于LED照明的开关与调光控制，实现高效驱动；
- 电机控制：在小功率直流电机控制中，可作为开关元件实现 PWM 控制；
- 移动设备：在智能手机、平板电脑等便携设备中，由于其小型封装和高效性能，非常适合用于电源管理电路；
- 消费电子产品：在各种消费电子中，实现高效、紧凑的功率调节。
五、总结
WNM3013-3/TR N沟道MOSFET是WILLSEMI公司推出的一款高性价比电子元件，凭借其380mW的功率处理能力、50V的击穿电压、250mA的漏电流及小巧的SOT-723封装，满足了现代电子产品对高效率、小尺寸的设计需求。无论是开关电源、LED驱动还是移动设备等广泛应用场景，这款产品都表现出优越的性能和可靠性，必将成为设计工程师的优选元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
