Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
WILLSEMI ESD56151W04-2/TR ESD56151W04
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WILLSEMI ESD56151W04-2 / TR
- Type
- WILLSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WILLSEMI
- Electronic Component
- ESD56151W04-2/TR
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 280pF
- Electronic Component
- BM0093065575
- Voltage
- 6.5V
- Electronic Component
- IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 100nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ESD56151W04-2/TR 产品概述
概述
ESD56151W04-2/TR 是一款由 WILLSEMI（韦尔半导体）生产的双向ESD保护器件，采用 SOD-323 封装，专门设计用于保护敏感的电子元件免受静电放电（ESD）和电压瞬态的影响。此器件广泛应用于智能手机、平板电脑、笔记本电脑及其它消费电子设备的输入/输出接口。
特性
高 ESD 保护等级：该器件符合 IEC 61000-4-2 标准，支持最高 ±15kV 的接触放电和 ±20kV 的空气放电，能够有效抑制ESD造成的损害。
双向保护：产品设计能够提供双向的ESD保护，适用于对称和非对称的信号线，确保在实际应用中能够灵活适配；例如，可以用于 USB 和 HDMI 等常见接口。
快速响应时间：ESD56151W04-2/TR 具有快速响应的特性，使得在经历过突发电压时，能够迅速将过电压钳制在安全范围内，有效保障元器件的正常工作。
低电容：为了满足高速信号传输的需求，该器件设计了低电容（约为 0.5 pF），最大限度地减少对信号传输的影响，确保在高速数据传输时不发生信号衰减。
小型封装：SOD-323 封装使得该器件在体积上非常小巧，适合高密度的电路板设计，能够为设计师提供更大的布局灵活性。
应用领域
ESD56151W04-2/TR 适合于各种电子设备，主要包括但不限于：
- 消费电子：智能手机、平板电脑、笔记本电脑、台式机及其周边设备等。
- 通信设备：路由器、交换机和其他网络设备。
- 汽车电子：针对汽车电子内的各种接口和传感器的保护。
- 工业控制：应用于工控设备中的输入输出接口，有效避免静电对控制设备的影响。
- 医疗设备：确保医疗仪器中的电子元件具有高可靠性，避免因静电放电而导致设备的误动作。
典型应用电路
在实际应用中，用户可以将 ESD56151W04-2/TR 嵌入到敏感信号线和地之间，或是信号线与电源之间，以有效抑制静电放电和电压突变。在数字和模拟信号传输中，该器件能够提供很好的保护，确保信号的完整性和系统的安全性。
总结
ESD56151W04-2/TR 是一款高性能的ESD保护器件，凭借其优越的电气特性和小尺寸封装，极大地满足了现代电子产品对可靠性、效率和空间利用率的需求。作为WILLSEMI的代表产品之一，ESD56151W04-2/TR不仅提升了电子设备的稳定性，还为设计工程师提供了灵活的应用方案。在日益强化对ESD保护的重视的背景下，该产品无疑是电子设计中的优秀选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
