WMSIC Electronic Components

WILLSEMI WPM2092-3/TR WPM2092

ModelWPM2092-3/TR
PackageDFN-3L(1x0.6)
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI WPM2092-3 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
WPM2092-3/TR
Electronic Component
1
Package
DFN-3L(1x0.6)
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0227089743
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
320mW
Electronic Component
Electronic Component
Electronic Component
10000
Voltage(Vdss)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WPM2092-3/TR 产品概述

一、产品简介

WPM2092-3/TR 是 WILLSEMI(韦尔)推出的一款 P 沟道场效应晶体管(P‑FET),封装为 DFN-3L (1.0 × 0.6 mm)。器件针对低压、空间受限的便携及电源管理应用优化,工作温度范围宽 (-55 ℃ ~ +150 ℃),适合工业级与消费电子混合场景。

二、关键参数

  • 类型:P 沟道 MOSFET(单片,1 个 P 沟道)
  • 漏源耐压 Vdss:20 V
  • 阈值电压 Vgs(th):0.45 V(典型)——接近逻辑电平
  • 栅极电荷 Qg:1.1 nC @ 4.5 V(低门极负荷,有利于快速切换与低驱动能耗)
  • 连续漏极电流 Id:740 mA(理想散热条件下)
  • 功耗 Pd:320 mW(封装限制,需注意热设计)
  • 反向传输电容 Crss:19 pF @ 15 V(影响米勒效应与开关过渡)
  • 封装:DFN-3L (1 × 0.6 mm)

三、主要特性与优势

  • 低阈值(0.45 V)与低栅极电荷(1.1 nC)使其在 3.3 V / 4.2 V 等低压系统中易于驱动,适合作为高侧负载开关或电源路径开关。
  • 紧凑 DFN 封装有利于高密度 PCB 设计与空间受限设备。
  • 宽温度范围满足工业级可靠性要求。
  • 较小的 Crss 表明在切换过程中米勒区影响可控,有利于减小开关损耗与 EMI(需配合驱动策略优化)。

四、典型应用场景

  • 电池供电系统的高侧断开/负载开关(移动终端、可穿戴)
  • 电源路径管理与倒灌保护(充电器、USB/PD 子系统)
  • 电源管理 IC(PMIC)外围开关与功率路由
  • 小电流驱动与信号切换场合

五、使用建议与热管理

  • 由于 Pd 标称仅 320 mW,实际可用电流受 PCB 散热条件影响显著,建议在布局时加大铜箔面积或自身焊盘铜箔以降低结温。
  • 阈值极低,器件对门极电压变化敏感,须保证门极在预期工作点被可靠拉到全导通或全关断,避免半导通增加功耗。
  • 尽管 Qg 小,开关速度仍受 Crss 与驱动阻抗影响,若用于频繁切换场合,请评估开关损耗与 EMI。
  • 选用前建议获取或测量 Rds(on)、最大 Vgs 等完整电气特性,以确保符合系统容差;在无完整数据时对额定电流采取保守降额设计。

六、封装与焊接注意

DFN-3L (1×0.6 mm) 体积小,焊接工艺需控制回流温度曲线与焊盘设计,避免虚焊或过热导致可靠性问题。考虑到热传导有限,底部焊盘应设计为通孔或大面积散热铜箔以改善散热。

总结:WPM2092-3/TR 适合低压、低功耗、高密度电源路径控制应用。其低阈值与低栅极电荷是显著优势,但需重视封装热限与电流降额,配合合适的 PCB 散热与门极驱动方案即可发挥最佳性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.