WMSIC Electronic Components

WILLSEMI ESD73111CZ-2/TR ESD73111CZ

ModelESD73111CZ-2/TR
PackageDWN0603-2L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI ESD73111CZ-2 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD73111CZ-2/TR
Electronic Component
1
Package
DWN0603-2L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.15pF
Electronic Component
BM0231033226
Voltage
6.5V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD73111CZ-2/TR 产品概述

ESD73111CZ-2/TR 是 WILLSEMI(韦尔)推出的一款单路双向瞬态抑制器(ESD Protection),封装为 DWN0603-2L,专为需要低电容、高可靠性保护的高速信号线和接口电路设计。器件在应对静电放电和雷击脉冲等过电压事件时,能快速钳位并吸收能量,从而保护下游敏感芯片和接口电路。

一、主要参数一览

  • 型号:ESD73111CZ-2/TR
  • 类型:ESD(瞬态抑制二极管)
  • 极性:双向,单路保护
  • 钳位电压(Vclamp):6.5 V
  • 击穿电压(Vbr):11 V
  • 反向截止电压(Vrwm):5 V
  • 峰值脉冲功率(Ppp):30 W @ 8/20 μs
  • 峰值脉冲电流(Ipp):6 A @ 8/20 μs
  • 反向电流(Ir):1 μA
  • 结电容(Cj):0.15 pF(典型)
  • 通道数:单路
  • 防护等级 / 标准:符合 IEC 61000-4-5(浪涌);IEC 61000-4-2(静电放电)
  • 封装:DWN0603-2L
  • 品牌:WILLSEMI(韦尔)

二、关键特性与优势

  • 低钳位电压(6.5 V):在脉冲事件发生时能有效限制电压峰值,减小对后端芯片的应力。
  • 极低结电容(0.15 pF):对高速信号线影响极小,适合高速接口及差分信号保护,保持信号完整性。
  • 双向结构:可承受正负极性瞬态脉冲,适用于双向传输线或需双向保护的接口。
  • 合格的浪涌与静电标准:满足 IEC 61000-4-5 与 IEC 61000-4-2 要求,可靠性高,适合工业、消费和通信设备。
  • 紧凑封装 DWN0603-2L:节省 PCB 面积,便于贴片生产与自动化装配。

三、典型应用场景

  • USB、DisplayPort、HDMI、MIPI 等高速数据接口的输入/输出端保护
  • 手机、平板、笔电及消费电子的外部连接器防护
  • 工业控制与通信设备的信号线上拉与接口保护
  • 需要低电容、高速信号完整性的差分对与单端高速线路防护

四、使用与布局建议

  • 靠近受保护的连接器或接口放置器件,尽量缩短受保护器件与受保护节点之间的连线长度,以降低寄生电感和提高保护效率。
  • 将保护器件的接地端(若有)尽可能直接回流到系统地,保证低阻抗回流路径,减少环路面积。
  • 对于差分或多通道设计,注意保护器件与信号线的对称布局,避免引入失配或串扰。
  • 在贴片与回流焊接过程中,遵循厂家推荐的焊接工艺与温度限制,避免超出封装耐受范围(具体回流参数请参考厂商数据手册)。

五、选型提示与注意事项

  • Vrwm = 5 V,建议用于额定工作电压低于或等于 5 V 的接口,若系统工作电压高于 5 V,应选择更高 Vrwm 的器件。
  • 虽然器件支持 30 W@8/20 μs 的脉冲能量,但在系统设计中仍应结合实际浪涌等级和多次冲击情况评估器件寿命与系统级保护策略(如配合熔断器、阻抗限制元件等)。
  • 对静电敏感度高的场景,生产与维护环节请严格执行 ESD 管理规范,避免装配过程中产生损伤。

ESD73111CZ-2/TR 以其低电容、低钳位、双向防护和符合 IEC 标准的性能,适合对信号完整性要求高且需可靠瞬态保护的现代电子设备接口应用。有关更详细的电气特性、典型曲线与封装信息,请参阅制造商完整产品规格书。

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