WMSIC Electronic Components

WILLSEMI WPM6207-3/TR WPM6207

ModelWPM6207-3/TR
PackageSOT-23-3
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI WPM6207-3 / TR
Type
WILLSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
WPM6207-3/TR
Electronic Component
1
Package
SOT-23-3
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.049g
Electronic Component
1
Electronic Component
BM0265345562
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WPM6207-3/TR 产品概述

WPM6207-3/TR 是 WILLSEMI(韦尔)推出的一款 P 沟道场效应晶体管,封装为 SOT-23-3,专为低压高效能的高侧开关与电源管理应用设计。该器件在宽温度范围(-55℃ 至 +150℃)内保持可靠工作,适用于便携设备、电池保护、电源路径切换及各类开关应用。

一、主要电气参数

  • 漏源电压 Vdss:20 V
  • 导通电阻 RDS(on):60 mΩ @ VGS = 1.8 V(逻辑电平可驱通)
  • 连续漏极电流 Id:5.7 A
  • 耗散功率 Pd:1.2 W(SOT-23 封装热限制)
  • 阈值电压 |Vgs(th)|:1 V @ ID = 250 μA(以绝对值表示)
  • 栅极电荷 Qg:16.6 nC @ VGS = 4.5 V(影响开关损耗)
  • 输入/输出/反向传输电容:Ciss = 1.702 nF,Coss = 177 pF,Crss = 152 pF
  • 工作温度:-55℃ ~ +150℃
  • 封装:SOT-23-3

二、产品特性与优势

  • 低导通电阻(60 mΩ@1.8V),在较小栅极驱动电压下即可获得较低导通损耗,适合低电压系统。
  • 较高的连续电流能力(5.7 A),在合理散热条件下可驱动中等负载。
  • 中等栅极电荷(16.6 nC),在中低开关频率下兼顾开关损耗与开关速度。
  • 宽温度范围与工业级规格,适合严苛环境。

三、典型应用场景

  • 电池供电设备的高侧开关与电源路径选择(Power Path)
  • 移动设备、便携式仪器的负载切换与电源管理
  • 低压电源保护、反向电流阻断与热插拔控制
  • 小功率马达驱动、外设供电控制(需注意感性负载回路设计)

四、设计与使用建议

  • 作为 P 沟道高侧开关时,栅极电压需相对于源极产生足够的负向偏置以开启器件;反之栅极接近源极时关断。若源极电压随负载变化,建议采用 N 沟道驱动器或栅极驱动级以保证可靠驱动等级。
  • 由于 Qg 和 Ciss 较大,在高开关频率或快速驱动场合需考虑驱动能力及由此产生的额外开关损耗。可增加栅极电阻(典型 10–100 Ω)以抑制振铃并控制 dv/dt。
  • Crss(Miller 电容)显著,切换过程中注意米勒效应可能引起栅极电压回升,必要时增加栅极吸收或驱动缓冲。
  • SOT-23 封装的散热能力有限,实际 Pd 与 PCB 走铜面积、铜层数量及焊盘设计密切相关。高电流场合需加大散热铜箔并考虑热沉或多层板过孔导热。
  • 对于感性负载,请并联合适的续流二极管或采用吸收网络以保护器件免受瞬态电压冲击。

五、可靠性与资料查阅

为确保长期可靠性,应按系统工作点对 RDS(on)、热阻和短时脉冲能力进行验证;在高温或高电流条件下实施适当的降额。推荐参考 WILLSEMI 的完整数据手册获取 Vgs(max)、绝对最大额定值、SOA 曲线及封装尺寸图,以完成电路仿真与版图优化。

总结:WPM6207-3/TR 在 SOT-23 小封装下提供了良好的逻辑电平驱动能力与较低的导通损耗,适合中低压、高侧开关与电源管理场合。合理的驱动与散热设计可发挥其最佳性能。

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