WMSIC Electronic Components

WILLSEMI WD1042E-5/TR WD1042E

ModelWD1042E-5/TR
PackageSOT-23-5L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI WD1042E-5 / TR
Type
WILLSEMI
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
WD1042E-5/TR
Electronic Component
1
Package
SOT-23-5L
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.05g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230826902
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Switching Frequency
1.5MHz
Electronic Component
Electronic Component
Output Current
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WD1042E-5/TR 产品概述

一、产品简介

WD1042E-5/TR 是 WILLSEMI(韦尔)推出的一款高集成度降压型 DC-DC 开关稳压器,封装为 SOT-23-5。器件内置开关管并采用同步整流架构,支持可调输出、电流负载能力可达 1A,工作电压范围 2.5V 至 5.5V,适合中低电压电源轨的稳压与降压转换。工作温度范围为 -40℃ 至 +85℃,静态电流仅 40μA,适用于对待机功耗有严格要求的便携与电池供电设备。

二、主要参数与特性

  • 输出类型:可调(外接反馈电阻设定输出电压)
  • 拓扑结构:降压(Buck),同步整流
  • 输入电压范围:2.5V ~ 5.5V
  • 最大输出电流:1A
  • 开关频率:1.5MHz(高频有利于缩小滤波元件尺寸)
  • 开关管:内置(无需外接功率 MOSFET)
  • 静态电流(Iq):40μA(适合低功耗/待机场景)
  • 输出通道数:1 通道
  • 工作温度:-40℃ ~ +85℃
  • 封装:SOT-23-5(小体积,适合空间受限的板级设计)
  • 主要优势:高集成度、低静态电流、高开关频率、无需外部整流二极管

三、典型应用场景

  • 电池供电设备:可穿戴设备、手持仪器、便携式传感器节点
  • IoT 与智能终端:低功耗 MCU、无线通信模块(蓝牙、Wi‑Fi、LoRa)电源
  • 工业控制:为单片机和模拟前端提供局部稳压电源
  • 消费类电子:小型摄像头、便携音频设备、智能家居子板电源

四、外部元件选型与典型电路要点

  • 电感:选择适合 1A 工作电流、低 DCR、饱和电流高于峰值电流的功率电感。由于 1.5MHz 高频,电感量通常选取 µH 级以保证连续模式下的电流纹波和稳定性。
  • 输入/输出电容:优先采用 X5R/X7R 陶瓷电容以获得低 ESR、低 ESL 的滤波性能。输入侧需有近端去耦电容;输出侧电容容量与 ESR 影响纹波与环路稳定,按参考设计选择。
  • 反馈网络:通过外接电阻分压设定输出电压,精确度依赖反馈引脚参考电压与误差放大器特性(请参照器件数据手册获得参考值与推荐网络)。
  • 同步整流优势:器件内部已集成同步 MOSFET,常规设计无需外接肖特基二极管,从而降低功耗与器件数目。

五、PCB 布局与散热建议

  • 最短电流回路:将输入电容、开关节点(SW)、功率地的连接走线尽量缩短,减小开关回路面积以降低 EMI 与寄生环路电感。
  • 输入电容靠近 VIN-VSS 引脚布置,输出电容靠近 SW-L 输出回路放置,反馈电阻与反馈引脚之间的走线尽量短且避开开关噪声源。
  • 地平面:采用连续的大面积接地平面,有助于散热与抑制地阻抗。SOT-23-5 封装散热依赖 PCB 铜箔,热管理通过铺铜与必要的散热层实现。
  • EMI 管理:高开关频率利于减小被动元件尺寸,但对 EMI 要求更高,可在输入侧加入小量阻尼或滤波网络,并通过屏蔽与走线优化控制干扰。

六、可靠性与工程注意事项

  • 温度管理:在高环境温度或靠近热源时需评估功耗导致的结温上升,必要时通过铺铜或降低功耗确保器件在额定温度内工作。
  • 启动与过载保护:关注器件软启动、限流与热关断特性(以数据手册为准),在设计中考虑启动时的输入冲击与负载接入策略。
  • EMI/EMC 验证:完成板级样机后进行近场/远场 EMI 测试,调整布局与滤波以满足系统规范。
  • 老化与可靠性:如用于工业或长期运行场景,建议进行环境应力筛选和热循环测试以验证可靠性。

七、选型建议与结语

WD1042E-5/TR 以其低静态电流、高开关频率和内置同步整流等特性,适合对空间、功耗和成本敏感的电源设计场景。选型时应结合系统输入电压、负载电流峰值、纹波要求与 EMC 指标,按数据手册给出的典型应用参考值进行外部元件匹配与 PCB 布局。最终性能验证仍以样机测试与数据手册为准。

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