WMSIC Electronic Components

WILLSEMI ESD5451Z-2/TR ESD5451Z

ModelESD5451Z-2/TR
PackageDFN0603-2L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI ESD5451Z-2 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD5451Z-2/TR
Electronic Component
1
Package
DFN0603-2L
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
17.5pF
Electronic Component
BM0259511591
Operating Temperature
40℃~+85℃
Voltage
10V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ESD5451Z-2/TR

1. 产品简介

ESD5451Z-2/TR 是由WILLSEMI(韦尔半导体)生产的一款高性能静电放电(ESD)保护二极管,采用DFN0603-2L封装。作为移动设备、消费电子、计算机及通信设备等领域的理想选择,ESD5451Z-2/TR能有效保护电路和敏感元件免受瞬态电压和静电放电的损害。

2. 产品特性

ESD5451Z-2/TR具备下列主要特性:

  • 低击穿电压:ESD5451Z-2/TR具有较低的击穿电压,能够快速响应瞬态电压,确保设备的安全运行。
  • 高ESD保护等级:该器件符合IEC 61000-4-2标准,能够承受±8kV的接触放电及±15kV的空气放电,确保设备在极端环境下的稳定性。
  • 宽工作温度范围:工作温度范围为-55°C至+125°C,使其适用于各种应用场合,无论是在极寒还是高温环境中,都能保持高效能。
  • 低电容特性:其电容值低至1.0pF,适合高速数据传输应用,确保信号完整性。

3. 封装信息

  • 封装类型:DFN0603-2L
  • 尺寸:0.6mm x 0.3mm,适合空间有限的设计,易于集成进多种小型电子设备。
  • 引脚数:2引脚,简化了设计与布线。

4. 应用场景

ESD5451Z-2/TR 适用于广泛的电子应用,包括但不限于:

  • 移动设备:如智能手机、平板电脑及其他便携式设备的信号口、充电接口和耳机接口的ESD保护。
  • 消费电子:电视、音响及其他家庭电器中需要保护的输入输出端口。
  • 计算机周边设备:如鼠标、键盘和其他外设的连接接口保护。
  • 通信设备:在网络设备如路由器、交换机中,保护信号传输端口免受静电干扰。

5. 性能优势

相较于传统的ESD保护方案,ESD5451Z-2/TR在多个方面表现出明显的优势:

  • 高效能保护:能够快速响应突发的电压变化,降低对敏感芯片的危害。
  • 小型化设计:DFN0603-2L高集成度的设计为现代电子应用提供了设计灵活性,允许工程师在小空间中实现有效保护。
  • 降低功耗:低电压和低电容特性使得该二极管在保持高效保护的同时,能够减少系统整体功耗,提升产品的能效。

6. 结论

ESD5451Z-2/TR是WILLSEMI推出的一款高效、可靠的ESD保护二极管,广泛适用于各种电子产品,提供卓越的静电放电保护解决方案。其出色的性能和小巧的封装,使其成为现代电子设计中不可或缺的一部分。选择ESD5451Z-2/TR,能够为您的设备提供更强的保护,延长设备的使用寿命,并提升用户的使用体验。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.