Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
WILLSEMI WS72551E-5/TR WS72551E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WILLSEMI WS72551E-5 / TR
- Type
- WILLSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WILLSEMI
- Electronic Component
- WS72551E-5/TR
- Electronic Component
- 1
- Package
- SOT-23-5L
- Electronic Component
- Operational Amplifier
- Electronic Component
- 0.055g
- Electronic Component
- 1
- Electronic Component
- Output
- Features
- Electronic Component
- Electronic Component
- BM0228747270
- Operating Temperature
- 40℃~+125℃
- Amplifier
- 1
- Output Current
- 70mA
- (SR)
- 1.2V/us
- Power Supply Voltage
- 2.5V~5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WS72551E-5/TR 产品概述
一、产品简介
WS72551E-5/TR 是韦尔（WILLSEMI）推出的单路零温漂运算放大器，封装为 SOT-23-5L。器件支持轨到轨输入与轨到轨输出，适用于对直流精度与低频噪声要求高的测量和控制场景。器件工作温度范围为 -40℃ 至 +125℃，单电源供电范围 2.5V 至 5V（Vdd-Vss 最宽可达 9V），静态电流典型值 265µA，便于在低功耗系统中长期稳定运行。
二、主要性能特点
- 超低输入失调电压：Vos ≈ 14µV（典型），适合高精度零漂应用。
- 极小温漂：输入失调电压温漂约 8nV/℃（典型），保证长期倍率与环境稳定性。
- 宽带宽与适中速率：增益带宽积 GBP = 1.8MHz，压摆率 SR = 1.2V/µs，适合慢速到中速放大与滤波器设计。
- 极低输入漏电与失调电流：输入偏置电流 Ib ≈ 10pA，输入失调电流 Ios ≈ 6pA，利于高阻抗传感器接口。
- 低噪声：噪声密度 eN ≈ 80nV/√Hz（1kHz），适合低频信号处理与精密放大。
- 优良共模抑制：CMRR ≈ 140dB（典型），提高共模误差抑制能力。
- 输出能力：输出驱动电流可达 70mA，适合驱动一定负载或后级缓冲。
三、典型应用场景
- 精密差分放大与直流放大器（零漂测量、搬运低频微伏级信号）
- 电流检测与电流放大器（高侧/低侧检测配合低偏置电流）
- 精密滤波器与积分器（仪器放大、传感器信号调理）
- 数据采集前端、温度传感电路与电池供电便携设备
四、设计与使用建议
- 供电与退耦：在 Vdd/Vss 端使用 0.1µF 贴片陶瓷与 1µF 电解/钽电容并联退耦，靠近封装放置，保证瞬态稳定。
- 输入保护与接地：为维持超低偏置与低噪声，应缩短输入回路，使用低泄漏、低热漂电阻，关键信号走线加地屏蔽或使用 guard ring。
- 温度与热源隔离：器件精度依赖温漂，避免与发热元件紧邻，必要时使用局部恒温或散热设计。
- PCB 布局：模拟地与功率地分离，疏散高频开关环路，确保参考地平面完整，减少共模干扰。
五、封装与可获得性
WS72551E-5/TR 提供 SOT-23-5L 小封装，适合空间受限的便携或板载应用。推荐在精密测量与低频信号调理设计中优先评估样片，以验证系统级表现与温漂特性。
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