WMSIC Electronic Components

WILLSEMI ESD73021N-2/TR ESD73021N

ModelESD73021N-2/TR
PackageDFN1006-2L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
WILLSEMI ESD73021N-2 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD73021N-2/TR
Electronic Component
1
Package
DFN1006-2L
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0231033227
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD73021N-2/TR 产品概述

一、简介与定位

ESD73021N-2/TR 是韦尔(WILLSEMI)旗下的一款专用静电放电(ESD)保护器件,封装为 DFN1006-2L。该器件用于对敏感信号线和接口进行瞬态浪涌和静电放电的钳位保护,旨在在尺寸受限的消费电子、通讯和工业设备中提供可靠的防护解决方案。零件后缀 “/TR” 表示以卷带(Tape & Reel)形式供货,便于SMT贴装流水线使用。

二、主要特性(概览)

  • 小型化封装:DFN1006-2L 占板面积小,利于紧凑型 PCB 布局与高密度设计。
  • 专用 ESD 钳位:针对 IEC 61000-4-2 类静电冲击提供瞬态钳位保护,降低尖峰电压对下游芯片的应力。
  • 低寄生电容:适合高速数据线或接口保护,尽量减少对信号完整性的影响。
  • 双路保护或多功能排列:产品型号暗示可用于两路信号保护(具体功能请参考原厂数据表)。
  • SMT 兼容:卷带供货、可回流焊接,适合自动化生产。

三、典型应用场景

  • 手机、平板与可穿戴设备的外设接口(USB、耳机、触摸屏等)。
  • 摄像头模组、传感器与射频前端的输入保护。
  • 工业控制、物联网节点、消费类电子的信号线和通信接口。
  • 任何对体积、信号完整性要求较高、同时需 ESD 保护的电路板。

四、封装与布局建议

  • DFN1006-2L 为微小双引脚/多引脚封装,焊盘尺寸与过孔布局需严格按制造商推荐的 PCB land pattern 布置,保证焊接可靠性。
  • ESD 器件应靠近被保护的外部连接器放置,尽量缩短到被保护线的走线长度以减少串联电感。
  • 在输入端与地之间保持良好回流路径,必要时在附近增加低阻抗地平面或旁路电容以改善瞬态散热与回流。

五、选型与验证要点

  • 确认最大工作电压与泄漏电流是否满足信号链路要求,尤其用于高速或低压接口时要避免对正常信号造成影响。
  • 核对器件的击穿电压、钳位电压及 IEC/EN ESD 抗扰度等级,确保在目标测试条件(如 ±8kV 接触式、±15kV 空气式)下能承受并恢复。
  • 关注线路电容(典型 pF 级别)对信号带宽的影响,必要时进行时域或眼图测试验证信号完整性。
  • 在高可靠性或关键领域应用前,进行实际 PCB 测试、温度循环与重复 ESD 抗扰性测试。

六、可靠性与处理注意事项

  • 遵循常规静电敏感器件(ESD)处理规范:佩带防静电腕带,使用防静电台垫与导电工具。
  • 回流焊温度曲线应遵守制造商给定的焊接规范,避免超过最大焊接温度或超时。
  • 储存与运输时保持原厂防潮包装,如为密封卷带则按 MSDS 与湿度敏感器件(MSL)等级处理。

七、备货与资料获取

  • 型号后缀 /TR 表示卷带(Tape & Reel)包装,适合自动化贴装;单片或散装需求可咨询供应商。
  • 推荐在选型与批量采购前获取并参考韦尔官方数据手册(Datasheet)、封装图与应用说明,以获取器件的电气参数、典型曲线和推荐 PCB 尺寸。

结语:ESD73021N-2/TR 以其小型化 DFN1006-2L 封装和面向高频/高速信号线的低寄生特性,适合空间受限且对信号完整性有较高要求的应用场景。最终选用前请以厂商数据手册为准,并在目标系统中完成必要的验证试验。

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