Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RVT1E331M0810是HONOR(荣誉)品牌推出的通用型贴片铝电解电容,专为紧凑空间内的滤波、储能场景设计。产品型号中:
该电容的参数覆盖了通用电路的关键需求,具体如下:
参数项 规格值 意义说明 标称容值 330μF 满足电源滤波、耦合电路的基础储能需求 精度 ±20% 适配大多数通用电路的容值偏差要求 额定电压 25V DC 稳定承受电路工作电压波动,无需过度降额 工作温度范围 -55℃~+105℃ 支持极端环境(如车载、户外)长期工作 工作寿命 2000hrs@105℃ 高温下低失效率,经加速老化测试验证 电容体尺寸 8mm(直径)×10.2mm(长度) 与封装尺寸一致,适配PCB紧凑布局宽温适应性突出:
-55℃低温下无容量衰减、漏电流剧增问题;+105℃高温下仍保持稳定寿命,无需额外散热设计,适配温差大的场景(如车载-40℃~+85℃环境)。
小型化设计优势:
8×10.2mm贴片封装相比插件电解电容节省约30% PCB空间,适配便携式设备(如移动电源、蓝牙耳机充电盒)、小型模块的微型化需求。
高可靠性保障:
采用优质铝箔与耐温电解液配方,经高低温循环(-55℃~+105℃,100次)、耐湿老化(85℃/85%RH,1000hrs) 测试,符合工业级产品标准,降低售后风险。
贴装兼容性好:
SMD封装适配常规SMT贴片机,焊点牢固;回流焊工艺无虚焊、立碑风险,提升生产良率。
该电容凭借宽温、小型化、高可靠的特点,广泛应用于:
RVT1E331M0810作为通用型贴片电解电容,平衡了性能与成本:
对于需要紧凑空间、宽温适应性的电路设计,是性价比优异的核心元件选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products