WMSIC Electronic Components

WILLSEMI ESD54231N-2/TR ESD54231N

ModelESD54231N-2/TR
PackageDFN1006-2L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI ESD54231N-2 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD54231N-2/TR
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
17.5pF
Electronic Component
BM0231051920
Operating Temperature
40℃~+85℃
Voltage
11.5V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD54231N-2/TR 产品概述

ESD54231N-2/TR 是由 WILLSEMI(韦尔) 提供的一款双向瞬态电压抑制器(TVS),专为保护敏感低压信号线和接口免受静电放电(ESD)、电快速瞬变(EFT)及浪涌(Surge)冲击而设计。器件采用超小型 DFN1006-2L 封装,具备低电容、低漏电和快速响应等特性,适合高密度便携式电子和高速数据接口的过压保护需求。

一、产品亮点

  • 双向保护:支持正、负方向瞬态抑制,适用于差分与双向信号线(如数据总线、通信接口等)。
  • 低钳位电压:典型钳位电压 11.5 V,能在瞬态事件中有效限制电压峰值,保护下游芯片。
  • 低工作电压:反向截止电压 Vrwm = 5.5 V,适合 5 V 及以下系统保护。
  • 低结电容:Cj = 17.5 pF,减小对高速信号的影响,兼顾保护性与信号完整性。
  • 超小封装:DFN1006-2L 小尺寸,便于高密度 PCB 布局与自动化贴装。
  • 符合工业抗扰性标准:通过 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)和 IEC 61000-4-5(浪涌)相关要求。

二、主要电气参数(典型/标称)

  • 极性:双向(Bidirectional)
  • 反向截止电压 Vrwm:5.5 V
  • 击穿电压(Breakdown):6.1 V
  • 钳位电压(Clamping):11.5 V(在 Ipp 条件下)
  • 峰值脉冲电流 Ipp:8 A @ 8/20 µs
  • 峰值脉冲功率 Ppp:90 W @ 8/20 µs
  • 反向电流 Ir:1 nA(典型,常温)
  • 结电容 Cj:17.5 pF
  • 工作温度范围:-40 ℃ 至 +85 ℃

三、典型应用场景

  • USB、HDMI、DisplayPort 等 5 V 类高速接口的防护
  • 智能手机、平板、可穿戴设备等移动终端的 I/O 端口
  • 工业控制与通讯设备的信号线和串口保护
  • 摄像头模块、传感器接口以及其他对静电与瞬态敏感的外围电路

四、等效与工作原理简述

ESD54231N-2/TR 在正常电压下为高阻态,漏电流极小(Ir≈1 nA),对信号影响微弱;当瞬态过电压出现时,器件迅速进入导通状态,将瞬时能量通过近地回路泄放,从而将受保护节点电压限制在钳位电压附近,避免后级器件损坏。双向结构适合差分或双向施加电压的场合,无需外加极性保护元件。

五、封装与机械特性

  • 封装:DFN1006-2L(超小型,适合高密度 SMT 布局)
  • 封装优点:占板面积小、寄生电感小、便于靠近被保护引脚放置以提升防护效果和响应速度。

六、PCB 布局与使用建议

  • 尽量将 TVS 器件放置在被保护引脚和外部连接点之间的最短路径上,靠近连接器或接口焊盘,以缩短走线并降低寄生电感。
  • 为了形成低阻抗回流路径,应在 TVS 的地端附近使用足够的过孔或地平面,保证快速能量沉降。
  • 对高速差分信号,注意匹配走线阻抗并最小化 TVS 引入的电容不匹配。
  • 推荐在回流焊工艺下进行贴装,遵循制造商的焊接温度曲线以避免热损伤。

七、可靠性与合规

  • 该器件设计用于抗 ESd/EFT/浪涌冲击,经过对应 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5 规范的适配与验证,能在目标应用中提供可靠的瞬态能量吸收能力。
  • 在实际系统中,建议根据具体测试规范(例如 contact/air discharge 等级、EFT 速率、浪涌能量等级)进行整机级验证,以确保整体防护满足产品要求。

八、订购信息与封装形式

  • 型号:ESD54231N-2/TR(带卷带盘包装,适用于自动贴装生产)
  • 品牌:WILLSEMI(韦尔)
  • 封装:DFN1006-2L

总结:ESD54231N-2/TR 是一款面向 5 V 类信号与接口的高性能双向 TVS 器件,凭借低钳位、电容小、漏电低和紧凑封装的组合,能在保持信号完整性的同时对 ESD、EFT 和浪涌事件提供有效防护。适用于移动终端、消费电子、工业和通信设备等需要高密度保护方案的场景。若需更详细的参数曲线、封装尺寸图或应用电路图,建议参阅产品数据手册或联系供应商获取完整技术资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.