WMSIC Electronic Components

WILLSEMI ESD5491S-2/TR ESD5491S

ModelESD5491S-2/TR
PackageSOD-523
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI ESD5491S-2 / TR
Type
WILLSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD5491S-2/TR
Electronic Component
1
Package
SOD-523
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.031g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
9.9pF
Electronic Component
BM0228747267
Voltage
10V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
11nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5491S-2/TR 产品概述

一、产品简介

ESD5491S-2/TR 是 WILLSEMI(韦尔)推出的一款单路双向瞬态抑制器件,封装为超小型 SOD-523。器件针对低电压信号线设计,额定反向截止电压(Vrwm)和击穿电压均为 3.3V,提供快速的浪涌与静电放电(ESD)保护,适用于便携式、通信与工业接口等对体积与响应速度有严格要求的场合。后缀 TR 表示以 Tape & Reel 方式供货,方便贴片自动化生产。

二、主要参数(关键规格)

  • 极性:双向(Bidirectional)
  • 通道数:单路
  • 反向截止电压 Vrwm:3.3 V
  • 击穿电压(典型):3.3 V
  • 钳位电压(典型):10 V(在 Ipp 条件下)
  • 峰值脉冲电流 Ipp:9 A @ 8/20 μs
  • 反向电流 Ir:11 nA(典型)
  • 结电容 Cj:9.9 pF(典型)
  • 防护等级:满足 IEC 61000-4-2 (ESD)、IEC 61000-4-4 (EFT)、IEC 61000-4-5 (浪涌) 要求
  • 封装:SOD-523(超小型封装)

三、产品特性与优势

  • 双向保护:无需区分极性,适合数据线正/负两向瞬态抑制。
  • 低电容:典型结电容 9.9 pF,有利于高速信号线(如串行总线、数据接口)保持信号完整性。
  • 高瞬态吸收能力:在 8/20 μs 波形下可承受高达 9 A 峰值脉冲,钳位电压约 10 V,能有效钳制高能量瞬态。
  • 低漏电:反向漏电 11 nA 水平,适合对静态功耗敏感的低功耗系统。
  • 微型封装:SOD-523 体积小,便于在空间受限的移动终端与模块上使用。

四、典型应用场景

  • 3.3V 或以下的通信接口保护(UART、SPI、I2C 等)
  • 手机、平板、可穿戴设备的外部引脚保护(耳机插口、触摸屏接口)
  • 无线模块、GPS、蓝牙模块的天线或控制线保护
  • 工业控制与医疗设备中对电磁兼容性(EMC)要求较高的低压信号线

五、使用与PCB布板建议

  • 器件应尽可能靠近被保护的连接器或接口放置,缩短导线长度以降低感性串扰与钳位电压上升。
  • 地接地路径要低阻抗,建议在保护器附近设置一条粗短的接地回流路径或接地过孔(via),避免长距离回流。
  • 对于高频差分或单端高速信号,注意器件结电容对信号波形的影响,必要时通过增加阻尼或匹配网络进行补偿。
  • 在需要更低钳位电压或更高能量吸收能力时,可并联或串联其他保护元件或使用多级保护方案(例如一级浪涌抑制加二级快速 ESD 管)。

六、选型与注意事项

  • 虽然钳位电压典型值为 10 V,但在不同能量和布局条件下可能有所偏差;对下游敏感芯片请验证实际系统下的钳位电压。
  • SOD-523 的功耗与热量有限,不适合长期大功率连续冲击场景;如需多次高能量脉冲保护,应确认器件的重复脉冲能力和热管理。
  • 订购时注意后缀 /TR 表示卷盘供货(Tape & Reel),便于自动贴片。

本器件凭借小体积、低电容与合格的瞬态承受能力,是面向 3.3V 及以下低电压信号系统的实用 ESD 保护选择。选用时建议在目标系统上进行实测验证,以确保在特定布局和工况下满足保护需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.