WMSIC Electronic Components

WILLSEMI ESD5611N-2/TR ESD5611N

ModelESD5611N-2/TR
PackageDFN1006-2L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI ESD5611N-2 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
ESD5611N-2/TR
Electronic Component
1
Package
DFN1006-2L
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.009g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
65pF
Electronic Component
BM0226016483
Voltage
11V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
50nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5611N-2/TR 产品概述

一、产品简介

ESD5611N-2/TR 是 WILLSEMI(韦尔)推出的一款单路双向 TVS 二极管,用于静电放电(ESD)和浪涌(Surge)保护。器件特别针对 5V 级别信号线的瞬态抑制设计,兼容 IEC 61000-4-2(静电放电)与 IEC 61000-4-5(浪涌)标准,适合 USB、数据接口、微控制器 I/O 等对瞬态过压敏感的场合。封装为 DFN1006-2L,尺寸小巧,适合空间受限的便携与消费电子产品。

二、主要技术参数

  • 类型:TVS(瞬态电压抑制器)
  • 极性:双向(Bidirectional)
  • 通道数:单路
  • 反向截止电压 (Vrwm):5V
  • 击穿电压 (Vbr):5.2V
  • 钳位电压 (Vclamp):11V(典型值,测量条件:Ipp)
  • 峰值脉冲电流 (Ipp):25A @ 8/20µs
  • 结电容 (Cj):65pF
  • 反向电流 (Ir):50nA
  • 防护等级/标准:IEC 61000-4-2、IEC 61000-4-5
  • 封装:DFN1006-2L
  • 品牌/型号:WILLSEMI / ESD5611N-2/TR

三、关键特性与优势

  • 双向保护:能在双极性信号上抑制正负瞬态,适合差分信号或无固定参考的 I/O。
  • 低工作电压匹配 5V 系统:Vrwm≈5V,可直接并联于 5V 级信号或电源线上,触发点接近系统电压,提高保护灵敏度。
  • 良好浪涌承受能力:Ipp 25A(8/20µs)能应对常见的电涌冲击;钳位电压 11V 可将瞬态电压限制在器件和被保护电路可承受范围内。
  • 小体积封装:DFN1006-2L 体积小、寄生电感低,便于高速线路布局与密集安装。
  • 标准兼容:通过 IEC 61000 系列测试,便于系统满足 EMC/ESD 要求。

四、典型应用场景

  • USB(数据线保护,尤其是 VBUS/信号线需 5V 级保护的场合)
  • 消费类电子(手机、平板、便携设备的 I/O 口保护)
  • 工业与控制设备的低压信号输入端保护
  • 串行接口、键盘/触摸屏控制线、通用微控制器 I/O 端口

五、封装与 PCB 布局建议

  • 将器件尽量靠近需保护的引脚位置放置,缩短信号到 TVS 的走线长度以降低环路电感。
  • 对地端采用完整的接地平面或短回流路径,避免长回流路径引入额外噪声。
  • 对于双向保护,直接并联于两条信号线之间或线对间;若保护的是单端对地信号,请核实电路拓扑以避免功能冲突。
  • DFN 封装在回流焊接时需注意热剖面与焊盘设计,遵循厂商推荐的焊盘尺寸与回流曲线以保证可靠焊接。

六、选型与使用建议

  • 结电容 65pF 对高频高速差分接口(例如 USB3.x、PCIe 等)可能引入负载,请评估对信号完整性的影响;对于普通 USB2.0/TTL/串口等场合通常可接受。
  • 若系统需承受远超 25A 的浪涌或更苛刻的工业冲击,应考虑并联多个器件或选择更高 Ipp 级别的 TVS。
  • 对于对泄漏电流敏感的电路,50nA 的反向电流通常较小,但在超低功耗待机设计中仍需评估总体漏电预算。
  • 在产品认证与 EMC 设计阶段,可结合实际测试(IEC 61000-4-2/4-5)验证布局与器件性能,必要时调整器件位置或增加滤波元件以满足系统要求。

总体而言,ESD5611N-2/TR 以其针对 5V 级别的双向保护、适度的钳位与浪涌承受能力及小型 DFN 封装,适合多数消费类与工业低压信号保护场合。选用时关注结电容对信号影响与系统浪涌需求匹配,可实现可靠的瞬态防护。

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