WMSIC Electronic Components

WILLSEMI WAS4735Q-16/TR WAS4735Q

ModelWAS4735Q-16/TR
PackageQFN1826-16L(1.8x2.6)
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI WAS4735Q-16 / TR
Type
WILLSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
WAS4735Q-16/TR
Electronic Component
1
Package
QFN1826-16L(1.8x2.6)
Electronic Component
1.2GHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.031g
Electronic Component
1
Channel Count
4
Features
Analog
Electronic Component
BM0209267976
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~5.5V
Switch
4:1
(tpd)
2.2ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAS4735Q-16/TR 产品概述

一、产品简介

WAS4735Q-16/TR 是 WILLSEMI(韦尔)推出的一款高带宽、低延迟的模拟开关/多路复用器(4:1)。器件支持单电源工作,输入工作电压范围为 2.3V 至 5.5V,适合宽电压系统。工作温度范围为 -40℃ 至 +85℃,适应工业级环境。

二、主要参数

  • 开关类型:4:1 模拟开关 / 多路复用器
  • 工作电压:2.3V ~ 5.5V
  • 工作温度:-40℃ ~ +85℃
  • 传播延迟 (tpd):典型 2.2 ns
  • 带宽:1.2 GHz(-3dB)
  • 导通电阻 (Ron):7.5 Ω(典型)
  • 导通电容 (Con):6.5 pF
  • 封装:QFN1826-16L (1.8 × 2.6 mm)

三、主要特点与优势

  • 高带宽与低延迟:1.2 GHz 带宽配合 2.2 ns 延迟,适合高速模拟信号或射频前端切换。
  • 宽电压兼容:2.3V–5.5V 使其可在 3.3V 与 5V 系统中无缝应用。
  • 小封装、高密度:QFN1826-16L 体积小,利于空间受限的便携或移动设备。
  • 稳定的导通特性:7.5 Ω 的导通电阻和较小的导通电容,有利于保持信号完整性及减少失真。

四、典型应用场景

  • 射频/高频前端切换与信号选择
  • 音视频信号切换、多路输入选择
  • 测试测量仪器中的信号路由
  • 便携式和消费电子中的模拟信号复用

五、封装与电路布局建议

  • QFN 小封装需注意露铜热/地盘的回流焊工艺以及焊盘尺寸匹配。
  • 为降低寄生电容和串扰,输入/输出走线尽量短且布置对称,敏感信号使用地平面隔离。
  • 电源引脚推荐加去耦电容(0.1µF 附近)靠近引脚布置,以保证瞬态性能。

六、使用注意事项

  • 在高频应用中,请关注源/负载阻抗匹配以减少反射。
  • 导通电阻会随温度和电源偏差略有变化,需在系统级仿真中验证信号幅度与传输特性。
  • 开关控制逻辑电平应与器件工作电压相匹配,避免超出推荐工作区。

七、总结

WAS4735Q-16/TR 以其高带宽、低延迟、宽电压及小型封装的组合,适合对速度和尺寸有较高要求的模拟信号切换场合。合理的 PCB 布局和电源滤波能进一步发挥其性能优势。若需更详细的电气特性曲线与典型应用电路,建议参考器件数据手册。

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