WMSIC Electronic Components

WILLSEMI WL2836D12-4/TR WL2836D12

ModelWL2836D12-4/TR
PackageDFN1x1-4L
BrandWILLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WILLSEMI WL2836D12-4 / TR
Type
WILLSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WILLSEMI
Electronic Component
WL2836D12-4/TR
Electronic Component
1
Package
DFN1x1-4L
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0228747268
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
1.2V
Output Current
300mA
Output Type
Electronic Component
Output Channel Count
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WL2836D12-4/TR 产品概述

一、概述

WL2836D12-4/TR 是 WILLSEMI(韦尔)推出的一款小封装、低噪声固定输出线性稳压器(LDO),输出电压为 1.2V,最大输出电流 300mA。器件集成使能(EN)端、短路保护和过热保护,工作环境温度范围为 -40℃ 到 +85℃(Ta),封装为紧凑型 DFN1×1-4L,适合空间受限且对电源净化要求高的电路板应用。

二、主要特性

  • 固定输出:1.2V(正极输出)
  • 输入电压:典型工作电压 5.5V(器件可在此供电电压下工作)
  • 输出电流:最高可提供 300mA 连续负载
  • 高 PSRR:78dB @ 1kHz,良好的纹波抑制能力,适合降噪需求严格的电源设计
  • 保护功能:短路保护(限流)与热关断保护,提升系统可靠性
  • 控制端:带使能(EN)引脚,可实现电源软启动/关断或外部控制
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 封装:DFN1×1-4L,适合便携式与高密度应用

三、优势与设计价值

  • 低噪声、高 PSRR:78dB(1kHz)有效抑制来自开关电源或其它噪声源的干扰,适合为敏感模拟电路、ADC、RF 前端或 MCU 核心供电。
  • 小尺寸封装:DFN1×1-4L 占板面积小,适合手机、可穿戴、物联网终端等尺寸受限的产品。
  • 完善的保护机制:短路与过热保护降低了系统失效风险,配合 EN 引脚可实现灵活的电源管理策略。
  • 简化外围:固定输出省去外部分压设置,降低 BOM 与调试复杂度。

四、典型应用场景

  • MCU/FPGA/ASIC 的核心电源(1.2V rails)
  • 传感器、模拟前端与低噪声放大器供电
  • 通信与射频模块的基带或模拟电源
  • 电池供电或便携式设备的局部稳压
  • 工业控制与消费电子小型化电源模块

五、典型应用连接与封装、PCB 布局建议

典型应用电路非常简洁:输入端(IN)与地之间并联一个去耦电容,输出端(OUT)并联一个低 ESR 陶瓷电容,EN 引脚通过高电平使能或通过电阻拉低禁用以节省静态功耗。建议:

  • 输出电容:采用 X5R/X7R 陶瓷电容,容量与 ESR 依应用需求选择,常见值 1µF~10µF(参照厂方推荐的稳定性范围)。
  • 输入去耦:在 IN 引脚附近放置 1µF~10µF 陶瓷电容,尽量靠近器件引脚以降低寄生。
  • 布局:IN、OUT 与 GND 的走线尽量短且宽,GND 回路要可靠,DFN 底部散热焊盘应良好接地并设计为热通道以利散热。
  • 热管理:在高功耗或高环境温度条件下考虑 PCB 散热,配合器件的热关断保护使用可提高系统可靠性。

六、订购信息与注意事项

  • 型号:WL2836D12-4/TR(WILLSEMI)
  • 封装:DFN1×1-4L
    使用时请参考厂方完整数据手册,确认输入电压范围、输出电容稳定性条件及 EN 引脚的逻辑电平要求,以确保在目标应用中获得最佳性能与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.