WMSIC Electronic Components

WCH CH217K

ModelCH217K
PackageSOT-23-6
BrandWCH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
WCH CH217K
Type
WCH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WCH
Electronic Component
CH217K
Electronic Component
1
Package
SOT-23-6
Type
Load Switch
Electronic Component
Power Electronic Switch
Electronic Component
0.048g
Electronic Component
1
Channel Count
1
Features
Current; Output
Electronic Component
BM0225955041
Resistor
70mΩ
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~5.5V
Current
2.7A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CH217K 功率电子开关 产品概述

一、概述

CH217K 是南京沁恒(WCH)推出的一款单通道低侧/高速负载开关,集成多重保护与控制逻辑,适用于电源管理和负载隔离场景。器件支持宽工作电压范围与工业级工作温度,便于在消费类、通信与便携设备中实现可靠电源控制。

二、主要特性

  • 类型:单通道负载开关(Load Switch)
  • 工作电压:2.7V ~ 5.5V
  • 最大连续电流:2.7A
  • 导通电阻(Rds(on)):典型 70 mΩ
  • 输入控制逻辑:低电平有效(EN# / IN 控制)
  • 保护功能:过流保护(OCP)、欠压保护(UVP)、过温保护(OTP)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:SOT-23-6

三、电气与热特性(关键说明)

  • 在最大连续电流 2.7A 和 Rds(on) = 70 mΩ 条件下,器件最大耗散功率约为 P = I^2·R ≈ 0.51 W,PCB 热管理与散热设计需考虑这一损耗。
  • 集成的 OCP/UVP/OTP 提供器件与负载的多重保护:发生过流或过温时可限流或关断以防损坏;欠压保护可避免欠压下异常工作。
  • 输入为低电平有效控制,便于与微控制器或系统逻辑直接接口(详见数据手册中 EN/IN 信号时序与电平要求)。

四、封装与引脚(概要)

  • 封装:SOT-23-6,适合空间受限的 PCB 布局。
  • 典型引脚功能包括:输入电源 (IN)、输出 (OUT)、使能/控制 (EN,低电平有效)、地 (GND) 等。具体引脚排列与管脚定义请以原厂数据手册为准。

五、典型应用与使用建议

  • 典型应用:USB/外设电源开关、单节电池供电设备、电源序列管理、模块上电控制与负载断电保护。
  • 布局建议:IN/OUT 走宽铜并缩短回流路径,靠近 IN 侧放置去耦电容;在 OUT 侧根据负载放置必要的旁路/滤波电容以稳定输出。
  • 散热建议:当持续接近额定电流时,应留充足铜箔面积或敷铜过孔以增强散热,避免触发热关断。

六、注意事项与选型建议

  • 由于最大连续电流与导通损耗有限,建议在设计时留有余量(典型建议 20%~30% 余量)以提高可靠性。
  • 如系统需频繁承受大冲击电流或长时间高耗流,需评估是否使用更低 Rds(on) 或更高电流等级的器件。
  • 最终应用请以 CH217K 官方数据手册与评估板测试为准,确认 EN/控制时序、保护行为及热特性满足系统要求。

欲获取详细电气特性曲线、引脚定义、典型应用电路与时序图,请参考南京沁恒(WCH)CH217K 的完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.