Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WSD6056DN56是WINSOK(微硕)推出的一款中低压N沟道功率MOSFET,采用紧凑的DFN5x6-8表面贴装封装,针对60V以下电压范围的大电流应用场景优化,具备低导通电阻、高开关效率、宽温度适应等特点,可满足工业控制、电动工具、DC-DC转换等领域的设计需求。
WSD6056DN56属于N沟道增强型MOSFET,核心定位为60V/45A中低压大电流功率器件,封装类型为DFN5x6-8(尺寸5mm×6mm,8引脚布局),符合表面贴装工艺要求,适合高密度PCB设计。品牌为国内功率器件厂商WINSOK(微硕),产品系列覆盖中低压功率MOSFET,可靠性符合工业级标准。
导通电阻(RDS(on)):20mΩ(Vgs=10V时),属于同电压等级、同电流规格器件中的低水平。低RDS(on)可显著降低导通损耗(P=I²×R),减少电路发热,提升系统效率,尤其适合对功耗敏感的便携式或电池供电设备。
最大耗散功率(Pd):45W(T=25℃时),结合DFN封装的散热优势,可支撑持续大电流下的功率损耗,无需额外复杂散热设计。
WSD6056DN56采用DFN5x6-8封装,具备以下优势:
结合参数特性,WSD6056DN56适用于以下场景:
WSD6056DN56的核心优势可概括为:
该器件可有效平衡效率、体积与成本,是中低压大电流应用的高性价比选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products