WMSIC Electronic Components

WINSOK WSTDW01

ModelWSTDW01
PackageSOT-23-6
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSTDW01
Type
WINSOK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSTDW01
Electronic Component
1
Package
SOT-23-6
Electronic Component
Battery Management
Electronic Component
0.041g
Electronic Component
1
Electronic Component
BM0264498704
Operating Temperature
40℃~+85℃
Operating Voltage
2V~4.3V
Battery Type
Battery
ICType
IC
0VBattery
Electronic Component
Static Current(Iq)
100nA
and Voltage
4.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSTDW01 产品概述

WSTDW01 是微硕(WINSOK)推出的一款小型化锂电池保护芯片,采用 SOT-23-6 封装,面向对体积和静态功耗要求严格的便携式与低功耗电源系统。芯片集成过充、过放、过流与短路多重保护功能,适用于单节锂离子/锂聚合物电池管理,工作温度范围宽,适应工业级应用环境。

一、核心规格速览

  • 芯片类型:保护芯片(锂电池保护)
  • 工作电压:2.0V ~ 4.3V(典型电池检测/工作范围)
  • 充电饱和电压(过充检测):4.3V
  • 电池类型:锂电池(Li-ion / Li-poly)
  • 工作温度:-40℃ ~ +85℃
  • 电池温度检测:不支持
  • 0V 电池充电:不支持(不具备从零压唤醒充电功能)
  • 静态电流(Iq):约 100 nA(极低待机功耗)
  • 功能特性:过流保护、过充保护、过放保护、短路保护
  • 封装:SOT-23-6
  • 品牌:WINSOK(微硕)

二、功能与优势

WSTDW01 将常见的锂电安全保护功能集成在小型封装内,便于在空间受限的电池模组中使用。主要优势包括:

  • 低静态电流:100 nA 的静态电流非常适合对待机续航有严格要求的系统,如无线传感器、可穿戴设备和低功耗物联网终端,可显著延长休眠期间的电池寿命。
  • 全面保护机制:集成过充、过放、过流与短路保护,能够在异常工况下快速断开电路,保护电池与负载安全。
  • 宽温度范围:-40℃ 到 +85℃ 的工作温度适应户外和工业环境使用场景。
  • 小体积封装:SOT-23-6 易于 SMT 装配,适合体积受限的电路板布局。

三、典型应用场景

  • 便携式消费电子:蓝牙耳机、便携式音箱、小型数码产品等。
  • 可穿戴与医疗设备:低功耗传感器、健康监测设备(需注意无温度检测功能)。
  • 物联网终端:电池供电的传感器节点、遥测设备、智能门锁等。
  • 电池模块保护:单节锂电池保护板及小容量电源模组。

四、设计注意事项

  • 0V 唤醒限制:WSTDW01 不支持对已完全放电到 0V 的电池进行自动唤醒充电。对于存在深度放电风险的应用,建议在系统设计中加入预充电电源或外部唤醒电路。
  • 温度管理:芯片自身不支持电池温度检测,如系统对充放电温度有要求,应外加温度传感器并在主控层面做温度保护。
  • 电压范围核对:产品资料中给出基本工作电压为 2V4.3V;有文档提及更宽的输入耐受范围(1.5V9V),在实际设计中应以最终数据手册与应用说明为准,避免超出允许电压导致器件失效。
  • 布局与散热:SOT-23-6 封装占板面积小,但在高电流保护动作或短路状态下可能产生热量,建议合理布局过流路径并评估热承载能力。

五、封装与选型提示

WSTDW01 采用行业常见的 SOT-23-6 封装,便于在现有保护板和模组中替换或集成。选型时请关注最终数据手册中的具体阈值(过充/过放/过流/短路触发点)、延时参数以及外部 MOSFET 驱动兼容性,确保与所用电池和系统拓扑匹配。

六、结论

WSTDW01 是一款面向单节锂电池、强调超低静态电流和小型化封装的电池保护芯片,适合对续航与体积有严格要求的消费电子与物联网设备。其集成的多重保护机制和工业级温度范围使其在多种应用场景中具有实用价值。为保证可靠性,建议在设计阶段参考完整数据手册,并针对 0V 充电与温度监控等限制制定相应补充方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.