Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WSP4099是WINSOK(微硕)推出的双P沟道增强型MOSFET,采用SOP-8小封装集成两颗独立P沟道管,专为低压(≤40V)、中电流(≤6.5A) 场景设计,兼顾小体积、低损耗与快速开关特性,适合空间紧凑、效率要求较高的电子系统(如便携式设备、低压电源模块)。
导通电阻(RDS(on))62mΩ@4.5V/4.5A:
P沟道MOSFET因载流子特性,导通电阻通常高于N沟道,WSP4099的62mΩ(低栅压4.5V下)表现优异——以4.5A电流为例,单管导通损耗仅约1.24W,大幅减少系统发热与能量损耗,提升电源效率。
采用SOP-8表面贴装封装,相比两颗分立P沟道MOSFET(如TO-252封装)节省约50%的PCB面积,适合便携式设备、小型电源模块等空间受限场景;WINSOK封装工艺具备良好焊接兼容性(回流焊、波峰焊均适配),且通过RoHS环保认证,符合全球市场准入要求。
WINSOK(微硕)是国内功率半导体领域成熟厂商,专注MOSFET、二极管研发生产,产品通过ISO 9001质量体系认证;WSP4099批次一致性、可靠性符合商用/工业级标准,适合批量应用于消费电子、工业控制、汽车电子周边等领域。
该器件以“小封装集成、低损耗、宽温适配”为核心优势,精准匹配低压中电流场景的需求,是替代分立P沟道管的高性价比选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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