WMSIC Electronic Components

WINSOK WSD60N10GDN56

ModelWSD60N10GDN56
PackageDFN5x6-8
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSD60N10GDN56
Type
WINSOK
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSD60N10GDN56
Electronic Component
1
Package
DFN5x6-8
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.17g
Electronic Component
1
Electronic Component
BM0264368931
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
125W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSD60N10GDN56 场效应管(MOSFET)产品概述

WSD60N10GDN56是WINSOK(微硕)推出的一款N沟道增强型MOSFET,针对中高压、大电流场景优化设计,具备低导通损耗、宽温可靠性及小尺寸高密度封装等特点,适用于车载、工业电源、消费电子等多领域应用。

一、产品基本定位与核心属性

该器件属于中低压大电流MOSFET,核心定位为替代传统功率器件(如BJT),实现高效、小型化的功率转换与控制。作为单N沟道器件,其电压、电流规格覆盖100V/60A主流应用区间,可满足多数低压功率系统的需求,尤其适合对效率、尺寸敏感的场景。

二、关键电气参数深度解析

参数是评估MOSFET性能的核心依据,WSD60N10GDN56的关键参数可分为以下维度:

1. 电压与电流承载能力

  • 漏源击穿电压(Vdss):100V,确保器件在系统电压波动下(如车载12V/24V系统的瞬态过压)具备可靠的耐压裕量;
  • 连续漏极电流(Id):60A(25℃),支持持续大电流输出,满足电机驱动、大功率电源等负载需求;
  • 阈值电压(Vgs(th)):1V,低阈值电压降低驱动难度,兼容常用MCU或驱动IC的输出电平(如3.3V/5V),无需额外升压电路。

2. 导通损耗与效率

  • 导通电阻(RDS(on)):8.5mΩ(@10V Vgs、10A Id),属于同规格器件中的低水平。导通电阻直接决定导通损耗(P=I²R),低RDS(on)可显著提升系统效率,减少散热需求——以60A持续电流为例,导通损耗仅约3.06W,远低于高RDS(on)器件。

3. 开关特性与驱动兼容性

  • 栅极电荷量(Qg):49.9nC(@10V Vgs),适中的Qg平衡了开关速度与驱动损耗——既保证较快的开关响应(适合高频应用),又降低驱动电路的功率消耗(减少驱动IC选型压力);
  • 电容参数:输入电容Ciss=2.604nF、反向传输电容Crss=6.5pF、输出电容Coss=362pF。其中低Crss可有效抑制开关过程中的电压振荡,减少EMI(电磁干扰),简化系统滤波设计(无需额外复杂EMC电路)。

4. 功率与温度特性

  • 最大耗散功率(Pd):125W(25℃),支持器件在持续工作时的功率损耗;
  • 结温范围:-55℃~+150℃(Tj),宽温特性使其可适应极端环境(如车载低温启动、工业现场高温),提升系统可靠性(避免结温过高导致的失效)。

三、封装设计与散热性能

该器件采用DFN5x6-8封装,属于无引脚封装(DFN)的一种,具有以下优势:

  1. 小尺寸高密度:封装尺寸仅5mm×6mm,比传统TO-252等封装缩小约50%,节省PCB空间,适合小型化产品(如快充、电动工具);
  2. 优秀散热能力:DFN封装底部带有暴露焊盘,可直接与PCB铜箔连接,大幅提升热传导效率(热阻约1℃/W),确保125W功率耗散下的结温控制;
  3. 高可靠性:无引脚设计减少焊接缺陷,抗振动能力强,适合车载等振动环境(符合汽车级可靠性要求)。

四、典型应用场景

WSD60N10GDN56的参数特性使其适配多种低压大电流应用:

  1. 车载电子:12V/24V系统的DC-DC转换(如车载充电器)、电机驱动(座椅、车窗、雨刮器)、LED照明控制;
  2. 工业电源:低压开关电源(AC-DC输出12V/24V)、LED驱动电源(大功率户外照明)、小型逆变器;
  3. 消费电子:大功率快充(65W/100W)、移动电源的升压/降压模块、游戏主机电源;
  4. 电动工具:无刷电机驱动(电钻、电锯、割草机)、电池管理系统(BMS)的充放电控制;
  5. 新能源:小型储能系统(家庭储能)的充放电开关、光伏微型逆变器。

五、产品核心优势总结

相较于同规格竞品,WSD60N10GDN56具备以下突出优势:

  1. 高效低耗:低RDS(on)与适中Qg结合,实现导通损耗与开关损耗的平衡,提升系统整体效率(比传统MOSFET效率高3%-5%);
  2. 宽温可靠:-55℃~+150℃结温范围,覆盖极端环境应用,减少环境温度对系统的影响;
  3. 小型化设计:DFN5x6封装满足高密度PCB设计需求,适合便携式、小型化产品;
  4. EMI友好:低Crss抑制开关噪声,简化系统EMI设计,降低BOM成本;
  5. 驱动兼容:1V低阈值电压,适配主流MCU与驱动IC,无需额外驱动电路。

这款器件通过优化电气参数与封装设计,为低压大电流功率系统提供了高效、可靠的解决方案,是车载、工业及消费电子领域的优选器件之一。

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