WMSIC Electronic Components

WINSOK WSE3088

ModelWSE3088
PackageSOT-89
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSE3088
Type
WINSOK
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSE3088
Electronic Component
1
Package
SOT-89
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.146g
Electronic Component
1
Electronic Component
BM0258859031
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.8W
Electronic Component
Electronic Component
Electronic Component
1000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSE3088 N沟道场效应管(MOSFET)产品概述

WSE3088是WINSOK(微硕)推出的一款N沟道增强型MOSFET,专为低电压、中电流场景的小型化电子设备设计,具备低导通损耗、快速开关特性及宽温可靠性,广泛适配便携设备、小型家电等领域的电源管理与驱动需求。

一、产品基本定位

作为单管芯N沟道MOSFET,WSE3088聚焦30V以下低电压、7A以内中电流的应用场景,核心目标是在紧凑封装下实现高功率效率与稳定可靠性。其采用SOT-89-3小型表面贴装封装,既满足自动化生产需求,又适配便携设备的空间限制,是替代传统三极管或低性能MOSFET的理想选择。

二、核心电气参数详解

WSE3088的参数设计针对性强,关键指标直接服务于低损耗、快速开关的应用需求:

1. 电压与电流能力

  • 漏源击穿电压(Vdss):30V,覆盖常见低电压电源(如5V、12V、24V系统)的安全工作范围,避免过压损坏;
  • 连续漏极电流(Id):7A(25℃环境),是核心驱动能力指标,可满足小功率电机、LED阵列等负载的持续工作需求;
  • 脉冲漏极电流(Idp):结合连续电流与封装功耗,可支撑短时间(ms级)10A以上的脉冲负载(需参考降额曲线)。

2. 导通损耗与控制兼容性

  • 导通电阻(RDS(on)):28mΩ@4.5V/7A,这是衡量MOSFET导通损耗的核心指标——低阻值意味着导通时压降小、功率损耗低(损耗=I²×RDS(on)),例如7A负载下损耗仅为7²×0.028≈1.37W,远低于同类产品平均水平;
  • 阈值电压(Vgs(th)):1.5V@250uA,兼容3.3V、4.5V等常见MCU/控制器的输出电压,无需额外电平转换电路,简化系统设计。

3. 开关特性与电容参数

  • 栅极电荷量(Qg):[email protected],Qg越小则栅极驱动所需能量越少,开关损耗越低,适合高频(几百kHz)DC-DC转换场景;
  • 电容参数:输入电容Ciss=730pF、反向传输电容Crss=55pF、输出电容Coss=112pF,合理的电容搭配减少了米勒效应(Crss影响开关延迟),进一步提升开关效率。

4. 功率与温度范围

  • 耗散功率(Pd):1.8W(25℃),结合SOT-89封装的散热能力,支撑中等功率密度的电路设计;
  • 工作温度:-55℃+150℃,覆盖工业级(-40+85℃)与消费级(0~+70℃)需求,适应户外便携设备(低温)、家电内部(高温)等场景。

三、封装特性与可靠性

WSE3088采用SOT-89-3封装(3引脚),具有以下优势:

  • 小型化:典型尺寸2.9mm×2.5mm×1.1mm,比TO-92封装小60%以上,大幅节省PCB空间,适配智能穿戴、无线耳机等紧凑设备;
  • 贴装友好:引脚布局清晰,符合SMT自动化生产要求,降低生产难度与成本;
  • 可靠性:封装材料耐高温、抗潮湿,结合宽温范围,可通过高温存储、温度循环等测试,满足长期稳定工作需求。

四、典型应用场景

WSE3088的参数特性使其适配多类场景:

  1. 便携设备电源管理:智能手机/平板的充电电路、DC-DC buck转换器(如5V转3.3V);
  2. 小型家电驱动:电动牙刷、剃须刀的电机驱动,小型加湿器的水泵控制;
  3. LED照明驱动:小功率LED背光(如笔记本屏幕)、桌面台灯的恒流驱动;
  4. 智能穿戴设备:智能手表、手环的电源开关与负载控制;
  5. 工业小模块:低电压传感器模块的电源控制、小型继电器驱动。

五、核心竞争优势总结

相比同类30V/7A MOSFET,WSE3088的优势集中在:

  • 低导通损耗:28mΩ的RDS(on)领先同类,提升电路效率5%~10%;
  • 宽电压控制兼容:1.5V阈值电压无需电平转换,简化系统设计;
  • 快速开关效率:低Qg与合理电容参数,适配高频应用;
  • 小型化适配:SOT-89封装满足便携设备的空间限制;
  • 宽温可靠性:-55~150℃范围覆盖更多应用场景。

综上,WSE3088是一款针对低电压中电流场景优化的高性价比MOSFET,可有效提升电路效率、简化设计并适配小型化需求,是便携设备与小型家电领域的优选器件。

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