WMSIC Electronic Components

WINSOK WSD20L70DN33

ModelWSD20L70DN33
PackageDFN-8(3x3)
BrandWINSOK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINSOK WSD20L70DN33
Type
WINSOK
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINSOK
Electronic Component
WSD20L70DN33
Electronic Component
1
Package
DFN-8(3x3)
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.122g
Electronic Component
1
Electronic Component
BM0264549098
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
83W
Electronic Component
Electronic Component
Electronic Component
5000
Voltage(Vdss)
20V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WSD20L70DN33 产品概述

WSD20L70DN33 是 WINSOK(微硕)推出的一款高性能沟槽 P 沟道 MOSFET,专为同步降压转换器及各种电源管理场景优化。凭借高单元密度与低导通电阻的设计,该器件在低压大电流应用中表现出色,同时符合 RoHS 及绿色产品要求,100% 通过全功能可靠性认证,适合量产级别应用。

一、主要规格亮点

  • 类型:P沟道 MOSFET(沟槽工艺)
  • 漏源电压 Vdss:20V
  • 连续漏极电流 Id:70A
  • 导通电阻 RDS(on):6.7mΩ @ Vgs = 4.5V
  • 阈值电压 Vgs(th):约 0.6V(典型)
  • 总栅电荷 Qg:70nC @ 4.5V
  • 输入电容 Ciss:5.625nF;输出电容 Coss:927pF;反向传输电容 Crss:716pF
  • 功耗 Pd:83W(封装与散热条件相关)
  • 工作温度:-55℃ ~ +150℃
  • 封装:DFN-8 (3×3)

二、性能与应用侧重点

WSD20L70DN33 在 20V 电压等级内提供优异的导通性能,6.7mΩ 的低 RDS(on) 结合 70A 的高电流承受能力,使其非常适合用作同步降压转换器的高侧开关、负载开关、电源旁路与反向保护等。P 沟道器件在高侧驱动上可简化驱动电路(对需要把栅极拉低以导通的场合尤为方便),适合对简化驱动方案有要求的系统。

三、设计注意事项

  • 栅极驱动:Qg = 70nC 表明栅极驱动电流需求较大,高频切换时栅极驱动损耗显著,建议搭配有足够电流能力的驱动器或使用合适的栅阻以控制 dv/dt。
  • 开关损耗与频率:较大的 Ciss/Crss 会增加开关损耗,若用于高开关频率 (>500kHz) 设计,应在损耗预算与散热设计上做权衡。
  • 热管理:标称 Pd = 83W 需配合低热阻 PCB 设计(大铜箔散热、热过孔、地平面散热)以发挥器件性能,DFN-8 封装利于底部散热焊盘接地并热传导到 PCB。
  • 布局建议:将 MOSFET 靠近电感与输入/输出电容,缩短电流回路,增大铜面积并使用热过孔;栅极走线短且避免与敏感信号平行。

四、可靠性与合规

WSD20L70DN33 符合 RoHS 要求并通过 100% 全功能可靠性测试,适合消费电子、电源模块与工业设备的量产应用。DFN-8 小型封装兼顾功率密度与 PCB 面积节省,利于高密度电路板设计。

五、典型应用场景

  • 同步降压转换器高侧开关
  • 移动设备与笔记本电源管理
  • 车载辅助电源(需注意车规级要求)
  • 负载开关与电源路径管理
  • 电池保护与功率分配模块

总之,WSD20L70DN33 在 20V 级别提供了低 RDS(on)、高电流能力与可量产的可靠性特性,适合要求高功率密度与简化高侧驱动方案的电源设计。设计时应兼顾栅极驱动能力与散热布局,以发挥器件最佳性能。

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