WMSIC Electronic Components

WINBOND W25N01GVZEIG

ModelW25N01GVZEIG
PackageWSON-8-EP(6.1x8)
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
WINBOND W25N01GVZEIG
Type
WINBOND
Unit
Electronic Component
Minimum package
4000 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W25N01GVZEIG
Electronic Component
1
Package
WSON-8-EP(6.1x8)
Electronic Component
NAND FLASH
Electronic Component
0.396g
Electronic Component
1
Features
OTP and; ECC; positions
Electronic Component
BM69414228
Electronic Component
1Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
10uA
Interface Type
SPI

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

W25N01GVZEIG 产品概述

1. 产品简介

W25N01GVZEIG 是由华邦电子(Winbond)公司推出的一款高性能 NAND Flash 存储器,采用 WSON-8 封装形式。这款闪存器件专为对存储容量、速度和能效有较高要求的应用而设计,适合用于多种消费电子产品、嵌入式系统以及其他需要可靠存储解决方案的场景。

2. 主要特性

  • 存储容量:W25N01GVZEIG 提供了 1Gb(128MB)的存储容量,适合中小型数据存储需求。
  • 接口:该器件支持 SPI(Serial Peripheral Interface)协议,便于与微控制器(MCU)或数字信号处理器(DSP)进行高速数据交换。
  • 高速读取和写入:产品提供的读取速度可高达 104MHz,写入和擦除操作的效率也得到了优化,非常适合高频率、快速的数据访问需求。
  • 低功耗设计:其设计考虑了低功耗需求,使其在待机和操作状态下都能有效减少能耗,延长电池使用寿命,适合便携式设备使用。
  • 耐久性:W25N01GVZEIG 具备良好的耐久性,支持多次擦写(通常为 100,000 次擦写周期),确保长期使用中的数据可靠性。

3. 应用领域

W25N01GVZEIG 在多种应用领域中表现卓越,包括但不限于:

  • 消费电子设备:如智能手机、平板电脑、摄像机等,能够存储音频、视频及应用程序等数据。
  • 嵌入式系统:用于工业控制、智能家居、医疗设备等,有助于实时存储和处理数据。
  • 物联网设备:随着物联网技术的快速发展,该 NAND Flash 可以作为储存单元,方便数据的收集和传输。
  • 数据记录器:在各种传感器和测量设备中,W25N01GVZEIG 能够实时存储数据,保证数据的持久性。

4. 技术规格

  • 封装类型:WSON-8,具备较小的尺寸特性,使其便于在空间有限的设计中使用。
  • 工作电压:通常工作在 2.7V 到 3.6V 的电源电压范围,确保广泛的应用兼容性。
  • 数据保持:在断电情况下,设备可保持数据长达 10 年以上。

5. 优势与竞争力

W25N01GVZEIG 的设计综合考虑了性能、存储效率以及成本,能够在相同类别产品中展现出显著的竞争优势。其高速读写性能、低功耗特性以及较高的数据耐久性,使其成为各种应用中理想的存储解决方案。此外,华邦电子以其完善的技术支持和产品可靠性,使得 W25N01GVZEIG 更具市场竞争力。

6. 结论

作为华邦电子的代表性产品,W25N01GVZEIG 将先进的 NAND Flash 技术与优化的运行特性相结合,能够满足现代电子产品在存储、速度以及能效方面的多重需求。随着技术的不断进步和市场应用场景的扩展,W25N01GVZEIG 有望在未来的存储解决方案中继续发挥重要作用,是电子设计师和工程师们值得信赖的选择。无论是在消费电子、工业自动化还是物联网等领域,这款 NAND Flash 都能提供卓越的性能与应用灵活性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.