Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
WINBOND W25Q128JVSIQ
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WINBOND W25Q128JVSIQ
- Type
- WINBOND
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WINBOND
- Electronic Component
- W25Q128JVSIQ
- Electronic Component
- 1
- Package
- SOIC-8-208mil
- Electronic Component
- NOR FLASH
- Electronic Component
- 0.57g
- Electronic Component
- 1
- Features
- positions
- Electronic Component
- BM0007170389
- Electronic Component
- 128Mbit
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.7V~3.6V
- Current
- 1uA
- Interface Type
- SPI
- Electronic Component
- 100000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
W25Q128JVSIQ 产品概述
1. 产品简介
W25Q128JVSIQ 是由华邦电子（Winbond）生产的一款高性能非易失性闪存芯片，采用先进的闪存技术，特别适合嵌入式应用。该芯片提供128Mbit的存储容量，相当于16M x 8位的组织结构，能有效满足多种数据存储需求。
2. 存储器类型与技术
作为一款NOR闪存，W25Q128JVSIQ 在可编程性和随机读取方面具有显著优势，相比于传统的NAND闪存，NOR闪存支持直接寻址，适合执行代码和存储小量数据。其采用的闪存技术能够实现快速、可靠的数据写入与擦除，确保程序的高效执行。
3. 存储容量与接口
该芯片的存储容量为128Mbit，适合存储较大的固件代码或数据，并能支持复杂的应用需求。W25Q128JVSIQ 使用SPI（串行外设接口）进行数据传输，并支持四线I/O、QPI（四线并行接口）和DTR（双向传输）模式，提供了灵活的接口选择。这些接口模式不仅提高了数据传输速率，还简化了与微控制器或处理器的连接。
4. 性能参数
在时钟频率方面，W25Q128JVSIQ 最高可达133MHz，确保快速的数据读取和写入操作。芯片的写周期时间为3ms，适合需要快速写入响应的应用。此外，W25Q128JVSIQ具备小的空闲时间，能够提高系统整体效率。
5. 电源要求
W25Q128JVSIQ 的供电电压范围为2.7V至3.6V，适合大多数嵌入式系统、消费电子和工业应用。这种灵活的电压需求使其能够与各种微控制器和其他数字电路兼容。
6. 工作温度范围
该芯片的工作温度范围为-40°C至85°C，适合在严苛环境下使用，常见于工业、汽车及户外设备等领域。它的广泛工作温度能够保障设备在高温、低温条件下稳定运作。
7. 封装与安装
W25Q128JVSIQ 采用8-SOIC封装（0.209"，5.30mm 宽），这一封装形式方便表面贴装（SMT），对焊接和组装工艺要求较低。紧凑的封装设计帮助节省板上空间，适合小型电子设备的设计需求。
8. 应用场景
W25Q128JVSIQ 适用于多种应用场景，包括但不限于：
- 嵌入式系统的固件存储
- 计算机外设如键盘和鼠标的配置存储
- 网络设备如路由器和交换机的自动恢复配置
- 消费电子产品的音频及视频存储
- 工业设备和汽车电子的配置和代码存储
9. 总结
W25Q128JVSIQ 是一款功能强大的非易失性闪存芯片，凭借其128Mbit的存储容量、灵活的接口选项以及广泛的工作温度范围，能够支持多种复杂的应用。其高性能和可靠性使其成为嵌入式系统设计中的理想选择，为电子产品的存储需求提供了强大的支持。无论是在消费电子、工业自动化、汽车电子还是其他高科技领域，W25Q128JVSIQ 都显示出优异的性能表现。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
