Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
WINBOND W25Q128JVEIQ
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WINBOND W25Q128JVEIQ
- Type
- WINBOND
- Minimum package
- 4000 卷
Technical parameters
- Electronic Component
- WINBOND
- Electronic Component
- W25Q128JVEIQ
- Electronic Component
- 1
- Package
- WSON-8-EP(6x8)
- Electronic Component
- NOR FLASH
- Electronic Component
- 0.11g
- Electronic Component
- 1
- Features
- positions; Power Supply
- Electronic Component
- BM0220384774
- Electronic Component
- 128Mbit
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.7V~3.6V
- Current
- 10uA
- Interface Type
- SPI
- Electronic Component
- 100000
- Clock Frequency(fc)
- 133MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
W25Q128JVEIQ 产品概述
一、产品简介
W25Q128JVEIQ是由台湾华邦半导体（Winbond）生产的一款高性能NOR闪存存储器。其主要特点包括128Mb（16M x 8）的存储容量、支持SPI四I/O、QPI和DTR接口，设计用于各种嵌入式系统中，以便在需要高速度与高效率的数据存储时满足应用需求。该器件采用表面贴装型（SMT），因此在现代电路板设计中具有更好的设计灵活性和空间利用率。
二、技术规格
- 存储容量: W25Q128JVEIQ拥有128Mb的存储能力，以每字节8位数据的格式存储，能够满足大多数数据保存需求，适合用作代码存储、数据采集或固件升级等应用。
- 接口支持: 本产品支持SPI（Serial Peripheral Interface）四I/O、Quad SPI以及双数据速率（DTR）等多种接口模式，这些接口的灵活性使得其在高速数据传输种表现尤为出色。
- 时钟频率: W25Q128JVEIQ拥有高达133MHz的时钟频率，具备快速的数据读写能力，能够满足对存储器响应时间较为严格的应用环境。
- 写周期时间: 其写入周期时间为3毫秒，这在大多数嵌入式应用中是一个可接受的写入速度。
- 工作温度范围: 该器件的工作温度范围为-40°C至85°C，适合用于工业级环境，确保在极端温度下仍然能够稳定运行。
- 供电电压: 工作电压范围为2.7V至3.6V，使其可以与多种电源系统兼容，适合低功耗应用。
- 闪存技术: W25Q128JVEIQ采用的是NOR闪存技术，具有快速的随机存取能力和较低的延迟，尤其适合运行代码或即时数据读取需求。
三、封装与安装
W25Q128JVEIQ采用WSON-8-EP（6mm x 8mm）的封装方式，优势在于体积小巧，能够更好地融入各种现代的电路板设计中，尤其是在空间受限的应用场合。此外，表面贴装的设计使得焊接与组装更加高效，进一步提升了生产效率与制造的可靠性。
四、应用场景
W25Q128JVEIQ广泛应用于需高速度和高密度存储的领域，特别是在以下几个方面表现突出：
- 嵌入式系统: 适用于各类嵌入式产品，如智能家电、物联网设备、汽车电子。
- 工业自动化: 在工业控制器、监控设备中，快速的数据处理和可靠的存储是必不可少的。
- 通讯设备: 用于数据存储的移动通讯和网络设备，能够保证信号的快速处理。
- 消费电子产品: 在智能手机、平板电脑及其他消费类电子产品中，用于存储应用程序及用户数据。
五、总结
W25Q128JVEIQ凭借其高性能的存储能力、快捷的读写速度以及广泛的应用兼容性，成为了众多电子设计工程师的优选存储器之一。无论是在新型产品的开发还是在现有产品的升级中，W25Q128JVEIQ都能够有效支持数据密集型应用需求。华邦半导体的这一产品，凭借其卓越的性价比与广泛的适用性，必将继续在闪存领域发挥重要作用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
