WMSIC Electronic Components

WINBOND W25Q128FVSIG

ModelW25Q128FVSIG
PackageSOIC-8-208mil
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINBOND W25Q128FVSIG
Type
WINBOND
Minimum package
2000

Technical parameters

Electronic Component
WINBOND
Electronic Component
W25Q128FVSIG
Electronic Component
1
Package
SOIC-8-208mil
Electronic Component
NOR FLASH
Electronic Component
0.41g
Electronic Component
1
Features
positions
Electronic Component
BM0000003100
Electronic Component
128Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
1uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
104MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

W25Q128FVSIG 产品概述

一、产品简介

W25Q128FVSIG 是华邦电子(Winbond)推出的一款高性能非易失性存储器,归类于闪存家庭中的 NOR Flash,具有 128Mb(16M x 8)的存储容量。这款存储器采用 SPI 四 I/O 接口和 QPI(Quad Peripheral Interface)技术,能够提供高速数据传输和高效的读写操作,广泛应用于智能设备、消费电子、工业自动化和其他嵌入式系统领域。

二、主要特点

  1. 存储容量和格式:

    • 容量:128Mb(16M x 8),满足大多数现代电子设备对存储容量的需求。
    • 类型:非易失性存储器,确保即使在电源关闭的情况下,存储的数据依然得以保留。
  2. 接口与传输速度:

    • 接口:采用 SPI 四 I/O 和 QPI 接口,支持并行数据传输,显著提高数据访问速度。
    • 时钟频率:最高支持 104MHz 的时钟频率,使得数据传输过程更加迅速和高效。
  3. 写入性能:

    • 写周期时间:字写入时间为 50µs,页写入时间为 3ms,能够高效完成存储数据的更新,适合高频次写入的应用场景。
  4. 电源需求:

    • 供电电压:工作电压范围为 2.7V 至 3.6V,适合在多种电源环境下使用,增强了设备的兼容性。
  5. 温度范围:

    • 工作温度:该存储器可在 -40°C 至 85°C 的环境中稳定工作,确保在严酷环境下依然能够持续稳定运行。
  6. 封装与安装:

    • 封装:W25Q128FVSIG 采用 8-SOIC 封装(0.209" 或 5.30mm 宽),适合于表面贴装,降低了对电路板空间的需求,使得设计更加灵活。

三、应用领域

W25Q128FVSIG 的高性能和灵活性使它适用于多种应用场景,包括但不限于:

  • 消费电子:智能手机、平板电脑、数码相机中的文件存储和固件更新。
  • 工业设备:嵌入式控制器、数据采集系统和工业自动化设备,用于存储参数和配置。
  • 汽车电子:车载信息娱乐系统、诊断工具和安全系统,支持数据记录和软件升级。
  • IoT 设备:智能家居、传感器和监测设备,通过提供可靠存储来支持数据记录和无线传输。

四、总结

W25Q128FVSIG 是一款高效的 NOR Flash 存储器,凭借其大容量、快速读写能力、兼容多种供电电压及宽温度工作范围,成为现代电子设备不可或缺的存储解决方案。其广泛的应用领域也进一步证明了其在当今快速发展电子技术中的重要性。如果您正在寻找一款性能优异、可靠性强且多功能的闪存存储器,W25Q128FVSIG 无疑是一个值得考虑的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.