WMSIC Electronic Components

WINBOND W25Q32JWBYIQ

ModelW25Q32JWBYIQ
PackageWLCSP-12
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINBOND W25Q32JWBYIQ
Type
WINBOND
Minimum package
4500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W25Q32JWBYIQ
Electronic Component
1
Package
WLCSP-12
Electronic Component
NOR FLASH
Electronic Component
0.048g
Electronic Component
1
Features
positions
Electronic Component
BM0264975712
Electronic Component
32Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~1.95V
Current
10uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WINBOND W25Q32JWBYIQ NORFLASH产品概述

W25Q32JWBYIQ是华邦电子(WINBOND)推出的一款串行NORFLASH存储器件,针对小型化、低功耗、高速读写场景优化,具备工业级可靠性与灵活的接口兼容性。以下从核心参数、封装特性、可靠性等维度展开概述。

一、核心身份与基础定位

该器件属于华邦W25Q系列NORFLASH产品线,型号明确为W25Q32JWBYIQ,类型为串行非易失性存储器(NORFLASH)。华邦电子作为全球知名半导体供应商,其存储产品在消费电子、工业控制等领域广泛应用,可靠性经市场长期验证。

二、关键性能参数解析

1. 存储容量与读写速度

存储容量为32Mbit(对应4MB),满足中等规模数据存储需求(如固件、配置参数、小容量日志等);支持最高133MHz的SPI时钟频率,可实现高速串行读写,减少数据传输延迟,适配对读写速度有要求的应用场景。

2. 功耗与电压特性

工作电压范围为1.7V~1.95V,属于低电压设计,适配电池供电的便携设备;待机电流仅10uA,极大降低闲置状态下的功耗,延长设备续航时间,尤其适合可穿戴、物联网节点等低功耗场景。

3. 擦写与写入效率

页写入时间(Tpp)为800us,块擦除时间(tBE)为200ms(针对64KB块),擦写效率处于同类产品主流水平,可满足固件更新、数据批量写入等操作的时间要求。

三、封装与接口特性

1. 封装形式

采用WLCSP-12封装(晶圆级芯片规模封装,12引脚),尺寸远小于传统SOIC、SOP封装,体积小、重量轻,适合对空间要求严苛的小型化设备(如智能手环、微型传感器)。

2. 接口类型

支持SPI串行外设接口,仅需4根核心连线(CLK、MOSI、MISO、CS),PCB布线简单,兼容性强,可与主流MCU、SoC直接对接,降低系统设计复杂度。

四、可靠性与环境适应性

1. 擦写寿命与数据保留

擦写寿命达100000次,可满足频繁固件更新、数据修改的应用需求;数据保留时间(TDR)为20年,长期存储数据稳定,避免因时间推移导致数据丢失,适合存储关键配置、固件等非易失性数据。

2. 温度范围

工作温度范围为-40℃~+85℃,属于工业级温度标准,可适应户外、车载、工业现场等恶劣环境(如低温户外监控、高温车载电子),环境适应性强。

五、典型应用场景

结合上述特性,W25Q32JWBYIQ适用于以下场景:

  • 可穿戴设备:智能手环、手表(低功耗、小封装);
  • 物联网终端:传感器节点、智能门锁(低功耗、SPI接口);
  • 工业控制:小型PLC、现场传感器(工业级温度、可靠性);
  • 消费电子:智能音箱、机顶盒(高速SPI、中等容量);
  • 车载周边:车载显示屏、辅助驾驶模块(宽温、小封装)。

六、选型价值总结

W25Q32JWBYIQ在体积、功耗、速度、可靠性之间实现平衡,尤其适合对小型化、低功耗有明确要求的场景。华邦品牌的技术支持与市场验证,进一步提升了产品的选型可靠性,是中等容量串行NORFLASH的优质选择。

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