WMSIC Electronic Components

WINBOND W25Q128JVPIM

ModelW25Q128JVPIM
Package8-WSON(6x5)
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
WINBOND W25Q128JVPIM
Type
WINBOND
Unit
Electronic Component
Minimum package
5000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W25Q128JVPIM
Electronic Component
1
Package
8-WSON(6x5)
Electronic Component
NOR FLASH
Electronic Component
0.108g
Electronic Component
1
Features
positions; Power Supply
Electronic Component
BM0264566210
Electronic Component
128Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
1uA
Interface Type
SPI

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

W25Q128JVPIM 产品概述

一、产品简介

W25Q128JVPIM 是 WINBOND(华邦)推出的一款高性能 SPI NOR Flash 存储器,容量为 128Mbit(16MB),支持最高 133MHz 的 SPI 时钟频率。该器件工作电压宽(2.7V~3.6V),拥有极低的待机电流和高可靠性的擦写寿命特性,适用于存储代码、引导程序、参数以及固件升级等多种嵌入式应用场景。器件封装为 8‑WSON(6×5mm),适合空间受限的系统设计。

二、主要规格

  • 存储容量:128Mbit(16MB)
  • 接口类型:SPI(高性能串行外设接口),支持高达 133MHz 时钟
  • 工作电压:2.7V ~ 3.6V
  • 待机电流:1 μA(典型)
  • 擦写寿命(耐久):100,000 次
  • 页面写入时间(Tpp):400 μs
  • 块擦除时间(tBE):150 ms(以 64KB 块为准)
  • 数据保持时间(TDR):20 年
  • 工作温度:-40℃ ~ +85℃
  • 封装:8‑WSON(6×5 mm)
  • 品牌:WINBOND(华邦)

三、关键功能特性

  • 硬件写保护:支持外部写保护引脚,可在硬件层面禁止写/擦操作,防止误写。
  • 绝对写保护:在特定引脚或配置下实现对整个器件或部分区域的不可撤销保护(固化保护设置)。
  • 写使能锁存(WEL):写操作前需设置写使能位,防止非法或意外写入。
  • 软件写保护:通过状态寄存器字段对特定扇区或块进行软件层面的写保护。
  • 上电复位(POR):内置上电复位电路,保证电源上电/掉电期间器件工作状态受控。
  • 电源锁定保护:在电源不稳定或低电平条件下,器件会禁止敏感操作以保护数据完整性。

四、性能与可靠性

W25Q128JVPIM 在性能与可靠性之间取得平衡:400 μs 的页面写入时间和约 150 ms 的 64KB 块擦除时间,适合大多数固件更新与数据记录场景;器件耐久度达到 100,000 次擦写循环,结合 20 年的数据保持能力,可满足工业级与消费级产品的长期使用需求。-40℃ 到 +85℃ 的工作温度范围使其适用于严格环境下的应用。

五、封装与系统集成

器件采用 8‑WSON(6×5mm)小型表贴封装,便于在体积受限的 PCB 上布局。作为 SPI NOR Flash,W25Q128JVPIM 可直接与 MCU/CPU 的 SPI 控制器相连,用于代码存储(引导 ROM)、资源文件、配置参数以及 OTA 固件存储等。推荐在电源引脚附近放置合适的去耦电容(例如 0.1 μF),并对 WP、HOLD(如有)等控制引脚使用合适的上/下拉以确保上电复位时处于定义状态。

六、典型应用场景

  • 嵌入式系统固件存储与引导(Boot ROM)
  • 网络设备与路由器的固件与配置保存
  • 工业控制器与数据记录设备的非易失性参数保存
  • 消费电子产品的资源文件与图片/音频存储
  • 智能终端/物联网设备的 OTA 升级空间

七、设计与使用建议

  • 电源管理:确保 VCC 在上电/掉电期间稳定,利用器件内置 POR 与电源锁定保护,仍建议合理的电源斜率与去耦设计以避免异常写入。
  • 写保护策略:对关键数据推荐同时启用硬件写保护与软件写保护,使用绝对写保护功能对不可变数据进行永久保护。
  • 时序与时钟:根据系统需求选择合适的 SPI 时钟频率,133MHz 高速模式可极大提升读写吞吐,但需确认主控与线路完整性(走线、阻抗匹配等)。
  • 擦写与寿命管理:合理分配擦写负载,避免频繁对同一区域进行擦写;在设计升级机制时采用差分更新或分区管理以延长使用寿命。
  • PCB 布局:WP/HOLD 等控制信号应靠近主控设计,且在 PCB 层保持良好电气隔离以减少误触发。

W25Q128JVPIM 以其 128Mbit 大容量、 133MHz 的高速 SPI 接口、完善的写保护与电源保护功能,结合工业级温度与高可靠性参数,适合各种需要可靠非易失性存储的嵌入式与工业应用。

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