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WINBOND W971GG6NB-25 W971GG6NB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- WINBOND W971GG6NB-25
- Type
- WINBOND
- Unit
- Electronic Component
- Minimum package
- 1672 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- WINBOND
- Electronic Component
- W971GG6NB-25
- Electronic Component
- 1
- Package
- VFBGA-84
- Electronic Component
- DDR SDRAM
- Electronic Component
- 1.119g
- Electronic Component
- 1
- Current
- 8mA
- Features
- Dynamic; Data
- Electronic Component
- BM0258630537
- Electronic Component
- 1Gbit
- Operating Temperature
- 0℃~+85℃
- Operating Voltage
- 1.7V~1.9V
- Operating Current
- 110mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
W971GG6NB-25 产品概述
一、产品简介
W971GG6NB-25 是 WINBOND（华邦）推出的一款并行接口 DDR2 SDRAM，存储容量为 1Gbit。器件采用 VFBGA-84（84-ball BGA）封装，工作电压范围 1.7V～1.9V（典型 1.8V），时钟频率 fc=400MHz（对应 DDR2-800 级别）。该器件面向需要高带宽、低电压、紧凑封装的嵌入式和消费类系统设计。
二、主要规格
- 存储器架构：SDRAM DDR2（并行接口）
- 存储容量：1Gbit（常见组织为 128M x 8）
- 时钟频率：fc = 400MHz（双倍数据速率，DDR2-800）
- 工作电压：1.7V ～ 1.9V（典型 1.8V）
- 工作电流：110mA（典型活动电流）
- 刷新电流：8mA（典型）
- 工作温度：0℃ ～ +85℃（商用温度范围）
- 封装形式：VFBGA-84（84WBGA）
三、功能与特性
- 高速数据传输：支持 DDR2 规格下的高频时钟与双倍数据速率，适合对带宽有要求的应用。
- 低电压工作：1.8V 供电降低功耗，适合便携和低功耗系统设计。
- 小型化封装：VFBGA-84 提供紧凑布局，便于空间受限的 PCB 设计。
- 标准接口兼容性：设计上兼容 JEDEC DDR2 系列控制器与主控芯片的常规时序与信号要求（具体以最新规格书为准）。
四、典型应用场景
- 嵌入式系统与单板计算机（SBC）
- 多媒体与消费电子（机顶盒、智能电视、机顶盒缓存等）
- 网络设备的缓冲与高速缓存应用
- 工业控制与仪器（在商用温度范围内的系统）
五、设计与使用建议
- 电源与去耦：在 VDD/VDDQ 引脚附近布局足量去耦电容，降低噪声并确保稳压。
- 时序与终端：遵循 DDR2 控制器的上电时序及终端电阻配置要求，控制地址/命令信号的阻抗匹配与回波抑制。
- 布线注意：地址/命令/时钟等关键线应进行长度匹配与差分/单端阻抗控制，减少串扰与时序误差。
- 散热与布局：虽然功耗较低，但在高负载或高密度系统中仍需关注散热与器件间距离。
- 可靠性与合规：在量产前以最新规格书为准完成电性、热特性和寿命评估；如需无铅或 RoHS 认证信息，请参考厂方资料。
六、总结
W971GG6NB-25 以 DDR2 高速架构、1Gbit 存储容量和紧凑的 VFBGA-84 封装，适合对带宽与体积有要求的商用设备和嵌入式应用。设计时应重视电源完整性、时序匹配与 PCB 布局，按照最新的 WINBOND 数据手册和 JEDEC 标准完成验证，以确保系统稳定可靠运行。若需器件完整电气参数、引脚排列和应用电路，请参照 WINBOND 官方规格书或联系供应商获取最新资料。
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